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Inorganic adhesive composition and hermetic sealing method using same

A technology of inorganic adhesives and compositions, applied in the direction of inorganic adhesives, chemical instruments and methods, non-polymer adhesive additives, etc., to achieve the effect of improving work efficiency

Active Publication Date: 2015-04-08
SAMSUNG CORNING PRECISION MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, toxic substances are emitted during this process

Method used

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  • Inorganic adhesive composition and hermetic sealing method using same
  • Inorganic adhesive composition and hermetic sealing method using same
  • Inorganic adhesive composition and hermetic sealing method using same

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Experimental program
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Effect test

Embodiment approach 1

[0055] The inorganic binder composition was produced from the following components by mixing with a stirrer: adding refractory inorganic filler as a mixture of alumina 20gr, cordierite 10gr and eucryptite 10gr, and 3 parts by weight of black pigment to 60gr including 70 Parts by weight of water glass and 30 parts by weight of distilled water in a mixed solution.

Embodiment approach 2

[0057] The inorganic binder composition is produced from the following components by mixing with a stirrer: a refractory inorganic filler that is a mixture of zircon 30gr, silica 20gr, and eucryptite 20gr, and 2 parts by weight of black pigment are added to 30gr including 83 weight Parts of water glass and 17 parts by weight of a mixed solution of distilled water.

Embodiment approach 3

[0059] The inorganic binder composition is produced by mixing with a stirrer from the following components: a refractory inorganic filler as a mixture of alumina 10gr, zircon 10g and cordierite 50gr, and 3 parts by weight of black pigment are added to 30gr including 83 weight Parts of water glass and 17 parts by weight of a mixture solution of distilled water.

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Abstract

The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.

Description

Technical field [0001] The present invention relates to an inorganic adhesive composition and a method for airtight sealing, and more particularly to an inorganic adhesive composition not accompanied by an organic solvent and an airtight sealing method using the inorganic adhesive composition. Background technique [0002] Airtight sealing is required to minimize the influence of humidity and gas from the outside, thereby improving the performance and durability of electronic components such as organic light emitting diodes (OLED), dye-sensitized solar cells (DSSC), or lighting equipment (LED). [0003] In particular, OLED has been accepted as a next-generation display technology due to its advantages such as high response time, self-luminescence without backlight, suitable for manufacturing ultra-thin panels, lower power consumption, and wide viewing angle. [0004] Since the OLED is easily affected by humidity and air, an airtight seal is implemented between the upper substrate and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/02C09J11/04C09K3/10H01L51/52
CPCC09J1/02C09J11/04H01L51/5246H10K50/8426C09K3/10C09K3/1003C09K3/1006C09K2003/1034H10K50/844H10K71/00C03C8/24C03C2204/00C03C2207/02
Inventor 李起渊金知满车在珉李在镐
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD
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