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Double-shaft split type differential silicon micromachined resonant accelerometer

An accelerometer and resonant technology, which is applied in the field of dual-axis split differential silicon micro-resonant acceleration inertial sensors, can solve the problems of serious cross-coupling of differential resonators, achieve the effects of improving sensitivity, improving quality factor, and eliminating coupling effects

Active Publication Date: 2015-04-08
SOUTHEAST UNIV
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Problems solved by technology

However, in practical applications, it is often necessary to use a two-axis or three-axis accelerometer to measure the accelerometer vector, and most of the existing two-axis structures have problems such as coupling between differential resonators or serious cross-coupling in the X and Y directions.

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  • Double-shaft split type differential silicon micromachined resonant accelerometer
  • Double-shaft split type differential silicon micromachined resonant accelerometer

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings.

[0031] A dual-axis split-type differential silicon microresonant accelerometer, such as figure 1 As shown, including the upper silicon micromechanical structure and the lower glass base, the upper silicon micromechanical structure is bonded on the lower glass base; the lower glass base is sputtered with signal leads, and the upper silicon micromechanical structure includes four The upper silicon micromechanical substructures are the first, second, third, and fourth upper silicon micromechanical substructures, and the first, second, third, and fourth upper silicon micromechanical substructures are arranged counterclockwise. On the lower glass base; among them, the differential structure formed by the first and fourth upper silicon micromechanical substructures constitutes the first group of acceleration measurement modules, and the differential structure formed by the s...

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Abstract

The invention discloses a double-shaft split type differential silicon micromachined resonant accelerometer which comprises an upper-layer silicon micromechanical structure and a lower-layer glass base, wherein the upper-layer silicon micromechanical structure is bonded on the glass base, the upper-layer silicon micromechanical structure consists of four upper-layer silicon micromechanical sub-structures which are completely identical, the upper-part structure and the lower-part structure at the left side form one group of differential structures for measuring an acceleration in a Y direction, and the upper-part structure and the lower-part structure at the right side form another group of differential structures for measuring an acceleration in an X direction. According to the double-shaft split type differential silicon micromachined resonant accelerometer disclosed by the invention, common mode errors between two groups of two resonators forming the differential structures can be effectively inhibited, the coupling influence between the two resonators is eliminated, and the decoupling between the X direction and the Y direction can be realized.

Description

technical field [0001] The invention relates to a two-axis split differential silicon micro-resonance acceleration inertial sensor, which belongs to the technical field of micro-electromechanical systems (MEMS) and micro-inertia measurement. Background technique [0002] Since the 1980s, the development of micro-electromechanical systems and micro-manufacturing technology has promoted the development of micro-inertial technology and micro-inertial instruments, leading to the generation of a new generation of accelerometers and gyroscopes. Micro-inertial instruments are mostly manufactured by semiconductor processing technology, with small size, light weight and low power consumption. Using silicon as a processing material and using a processing technology compatible with the manufacturing process of microelectronic integrated circuits can integrate the sensitive meter and signal processing circuit of silicon micro inertial devices on one chip, thereby realizing mass producti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/5621
CPCG01C19/5621
Inventor 黄丽斌高阳郭海鹏李晴云李宏生
Owner SOUTHEAST UNIV
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