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Printed circuit board with embedded heater

A technology for printed circuit boards and heaters, which is applied in the direction of printed circuits, printed circuit manufacturing, printed circuit components, etc. It can solve problems such as heater failure and slow heating, and achieve the effect of reducing heating cycles and improving operation

Inactive Publication Date: 2016-11-09
惠亚集团科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example a military jet may be required to take off in a twenty minute period and may not allow for slow heating or heater failure

Method used

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  • Printed circuit board with embedded heater
  • Printed circuit board with embedded heater
  • Printed circuit board with embedded heater

Examples

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Embodiment Construction

[0044] In the following detailed description, there are shown and described, by way of illustration only, certain exemplary embodiments of the present invention. As those skilled in the art will recognize, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Also in the context of the present application, when an element is referred to as being "on" or "coupled to" another element, it can be directly "on" or "coupled to" another element. Another element is either indirectly "on" or indirectly "coupled to" another element with one or more intervening elements interposed therebetween.

[0045] Heat generated by electrical current or electricity is one aspect of embedded heaters. In one embodiment, the embedded heater includes a heater circuit. A heater circuit (eg, copper circuit) within a PCB includes traces (eg, copper traces) that generate heat by utilizing Ohm's law and Watt's law (ie, the relatio...

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PUM

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Abstract

Aspects of the present invention relate to providing a printed circuit board comprising a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; A heater layer interposed between the conductive layers and configured to generate and transfer heat to at least one of the electronic components.

Description

[0001] Cross References to Applications [0002] This application claims the benefit of US Provisional Patent Application (Serial No. 61 / 586,691 ), filed January 13, 2012, the contents of which are hereby incorporated by reference in their entirety. technical field [0003] Aspects of the invention relate generally to printed circuit (wiring) boards, and more particularly to a printed circuit board with an embedded heater. Background technique [0004] Printed circuit boards (PCBs) are used in many electronic systems or devices, such as smartphones, networks, servers, routers, computers, automobiles, aviation, video games, TVs, and the like. PCBs are used to mechanically support and couple electronic components. PCBs can couple electronic components through conductive paths such as signal traces. These conductive paths may be formed, for example, by etching a conductive material (such as copper foil) on a non-conductive substrate (such as a laminate). A PCB may include o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B1/00
CPCH05B3/28H05B2203/006H05K1/0212H05K1/167H05K7/20H05K2203/06H05K2203/1115H05B2203/004
Inventor G.怀特
Owner 惠亚集团科技有限责任公司
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