Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Image sensing module and manufacturing method thereof

A technology of image sensing and manufacturing method, applied in image communication, radiation control device, TV and other directions, can solve problems such as thickness reduction, and achieve the effect of reducing the assembly inclination angle

Active Publication Date: 2015-02-25
AZUREWAVE TEHNOLOGIES INC
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thickness of traditional CMOS image sensors still cannot be effectively reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Image sensing module and manufacturing method thereof
  • Image sensing module and manufacturing method thereof
  • Image sensing module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0037] see Figure 1 to Figure 4 As shown, the first embodiment of the present invention provides a method for manufacturing an image sensing module M for reducing the overall thickness, which includes the following steps:

[0038] First, cooperate figure 1 and figure 2 As shown, an image sensing element 10 is provided, wherein the top of the image sensing element 10 has an image sensing region 100 ( S100 ). For example, the image sensing element 10 may be a Complementary Metal-Oxide-Semiconductor (CMOS) image sensing chip or any image sensor capable of image acquisition. However, the image sensing element 10 used in the present invention is not limited to the example mentioned in the first embodiment above.

[0039] Next, cooperate figure 1 and figure 2 As shown, a light-transmitting element 20 is supported above the image sensing element 10 by a plurality of supports 21, wherein the light-transmitting element 20 is located directly above the image sensing region 100 o...

no. 2 example

[0047] see Figure 5 As shown, the second embodiment of the present invention provides an image sensing module M for reducing the overall thickness, which includes: an image sensing unit 1 , a light transmission unit 2 , a substrate unit 3 and a lens unit 4 . The image sensing unit 1 includes an image sensing element 10 , wherein the top of the image sensing element 10 has an image sensing area 100 . The light-transmitting unit 2 includes a light-transmitting element 20 supported above the image sensing element 10 by a plurality of supports 21 , wherein the light-transmitting element 20 corresponds to the image sensing area 100 of the image sensing element 10 . The substrate unit 3 includes a flexible substrate 30 electrically connected to the image sensing device 10 . The lens unit 4 includes an opaque frame 40 disposed on the flexible substrate 30 and covering the transparent element 20 , and a lens assembly 41 connected to the opaque frame 40 and disposed above the transpa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An image sensing module (M) includes an image sensing unit (1), a light transmitting unit (2), a substrate unit (3) and lens unit (4). The image sensing unit (1) includes an image sensing element (10) having an image sensing area (100) on the top side of the image sensing element (10). The light transmitting unit (2) includes a light transmitting element (20) supported above the image sensing element (10) by a plurality of support members (21). The substrate unit (3) includes a flexible substrate (30) disposed on the image sensing element (10) and electrically connected to the image sensing element (10) through a plurality of electrical conductors (31), and the flexible substrate (30) has at least one through opening (300) for receiving the light transmitting element (20). The lens unit (4) includes an opaque holder (40) disposed on the flexible substrate (30) to cover the light transmitting element (20) and a lens assembly (41) connected to the opaque holder (40) and disposed above the light transmitting element (20).

Description

technical field [0001] The invention relates to an image sensing module and a manufacturing method thereof, in particular to an image sensing module for reducing overall thickness and a manufacturing method thereof. Background technique [0002] In terms of traditional known technologies, the special niche of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors lies in the characteristics of "low power consumption" and "small size", so CMOS image sensors are convenient Integrate into portable electronic products with special requirements, for example, CMOS image sensors can be easily integrated into mobile phones and notebook computers with small integration space. However, the thickness of conventional CMOS image sensors still cannot be effectively reduced. Therefore, how to effectively reduce the thickness of the traditional CMOS image sensor through the improvement of structural design has become an important issue that people in this field want to solve. Conte...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L31/18H01L31/12H04N5/2257H04N23/57H04N23/55H01L27/146H04N23/00
Inventor 许志行
Owner AZUREWAVE TEHNOLOGIES INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com