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LED display panel and packaging method thereof

A technology for light-emitting diodes and display panels, applied in organic light-emitting devices, organic light-emitting device structures, semiconductor devices, etc., can solve problems such as poor packaging, achieve good thermal conductivity, reduce adverse effects, and improve the effects of poor packaging

Active Publication Date: 2015-02-18
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a light-emitting diode display panel and its packaging method, so as to improve the poor packaging problem caused by stress release between the two substrates of the light-emitting diode display panel when the sealing material is melted

Method used

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  • LED display panel and packaging method thereof
  • LED display panel and packaging method thereof

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Embodiment Construction

[0037] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0038] The invention provides a light emitting diode display panel, such as figure 2 and Figure 5 As shown in , the LED display panel includes a first substrate 1 , a second substrate 2 , and a sealing compound 3 for connecting the first substrate 1 and the second substrate 2 . In the non-display area of ​​the LED display panel, one of the first substrate 1 and the second substrate 2 is provided with a first adsorption layer 5, and the other is provided with a second adsorption layer 6. The first adsorption layer The layer 5 and the second adsorption layer 6 can attract each other through magnetic force.

[0039] The LED display panel here may be an OLED (O...

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Abstract

The invention discloses an LED display panel and a packaging method thereof, and relates to the display technical field. The LED display panel comprises a first substrate, a second substrate and sealing-in materials used for connecting the first substrate and the second substrate. In a non-display area of the LED display panel, one of the first substrate and the second substrate is provided with first attraction layers, the other one of the first substrate and the second substrate is provided with second attraction layers, and the first attraction layers and the second attraction layers can be attracted with each other through magnetic force. According to the LED display panel and the packaging method thereof, the phenomenon that the first substrate and the second substrate can be separated due to stress relief in the fusing process of the sealing-in materials can be effectively avoided, and accordingly the bad packaging problem is solved; meanwhile, ferro magnetic materials are good in thermal conductivity and also can be used as heat conduction layers, and thus the bad influence of heat released in the fusing process of the sealing-in materials on a light-emitting unit can be reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a light emitting diode display panel and a packaging method thereof. Background technique [0002] At present, the light emitting diode display panel is mainly packaged by using a sealing compound (Frit). figure 1 It is a schematic cross-sectional view of an existing light-emitting diode display panel. The first substrate 1 and the second substrate 2 are packaged together by a sealing material 3 , wherein the second substrate 2 is provided with a light-emitting unit 4 . During the encapsulation process, the sealing material 3 is irradiated with a laser to melt it, and the first substrate 1 and the second substrate 2 can be packaged together when the sealing material 3 is solidified again. [0003] Since the laser can only irradiate part of the sealing material 3 at one time, when the partial sealing material 3 melts, stress release will occur between the first substrate 1 and t...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32H01L51/56
CPCH10K2102/302H10K59/8722H10K50/841H10K50/80H10K50/84H10K50/8426H10K71/00
Inventor 高昕伟王丹洪瑞孔超
Owner BOE TECH GRP CO LTD
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