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A chemical silvering solution and a silvering method

A technology of electroless silver plating and silver salt, applied in the field of electroless plating, can solve the problems of easy oxidation, yellowing and discoloration, poor stability and low utilization rate of the coating, and achieve the effect of fine and glossy coating and enhanced gloss.

Active Publication Date: 2015-02-11
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The slightly alkaline electroless silver plating solution has poor stability and low utilization rate, and the plating layer is prone to oxidation, yellowing and discoloration

Method used

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  • A chemical silvering solution and a silvering method
  • A chemical silvering solution and a silvering method
  • A chemical silvering solution and a silvering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Electroless silver plating solution: silver nitrate 0.5g / L; ammonium citrate 0.5g / L; ammonium sulfate 0.5g / L; cysteine ​​1ppm; sodium lauryl sulfate 3ppm; benzotriazole 1ppm; PEG- 1000 10ppm; use sodium hydroxide solution to adjust the pH value to 9.0 to obtain electroless silver plating solution A1;

[0026] Electroless silver plating:

[0027] 1. Degreasing: Ultrasonic degreasing of the copper workpiece to be plated;

[0028] 2. Acid etching: soak the workpiece to be plated obtained in step 1 with dilute acid solution to remove the oxide layer on the surface of the workpiece to be plated;

[0029] 3. Electroless silver plating: Heat the electroless silver plating solution A1 to 45°C, and then place the workpiece to be plated obtained in step 2 in the heated chemical silver plating solution to react for 9 minutes;

[0030] 4. Protection treatment: place the plated piece obtained in step 3 in a silver protectant for treatment for 3 minutes, and then dry to obtain the ...

Embodiment 2

[0033] Electroless silver plating solution: silver nitrate 0.5g / L; ammonium citrate 0.5g / L; ammonium sulfate 0.5g / L; cysteine ​​1ppm; benzotriazole 1ppm; sodium lauryl sulfate 13ppm; PEG- 1000 20ppm; use sodium hydroxide solution to adjust the pH value to 9.5 to obtain chemical silver plating solution A2;

[0034] Electroless silver plating:

[0035] 1. Degreasing: Ultrasonic degreasing of the copper workpiece to be plated;

[0036] 2. Acid etching: soak the workpiece to be plated obtained in step 1 with dilute acid solution to remove the oxide layer on the surface of the workpiece to be plated;

[0037] 3. Electroless silver plating: Heat the electroless silver plating solution A2 to 45°C, and then place the workpiece to be plated obtained in step 2 in the heated chemical silver plating solution for 9 minutes;

[0038] 4. Protection treatment: place the plated piece obtained in step 3 in a silver protectant for treatment for 3 minutes, and then dry to obtain a silver-plated...

Embodiment 3

[0041] Electroless silver plating solution: silver methanesulfonate 0.1g / L; ammonium citrate 0.25g / L; cysteine ​​1ppm; ceric sulfate 1ppm; benzotriazole 0.2ppm; sodium lauryl sulfate 50ppm; PEG-4000 10ppm; use sodium hydroxide solution to adjust the pH value to 8.6 to obtain chemical silver plating solution A3;

[0042] Electroless silver plating:

[0043] 1. Degreasing: Ultrasonic degreasing of the copper workpiece to be plated;

[0044] 2. Acid etching: soak the workpiece to be plated obtained in step 1 with dilute acid solution to remove the oxide layer on the surface of the workpiece to be plated;

[0045]3. Electroless silver plating: Heat the electroless silver plating solution A3 to 45°C, and then place the workpiece to be plated obtained in step 2 in the heated chemical silver plating solution to react for 9 minutes;

[0046] 4. Protection treatment: place the plated piece obtained in step 3 in a silver protectant for treatment for 3 minutes, and then dry to obtain a...

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Abstract

A chemical silvering solution is provided. The chemical silvering solution comprises a silver salt, a complexing agent, a pH conditioner and additives. The additives comprise benzotriazole and polyethylene glycol. The weight ratio of the benzotriazole to the polyethylene glycol is 1:2.5-50. The polyethylene glycol is PEG-1000 or PEG-400. The pH of the chemical silvering solution is 8.2-10.2. A chemical silvering method using the chemical silvering solution is also provided by the invention. Products obtained by using the chemical silvering solution are compact and uniform in appearance, while products obtained by using silvering solutions of the same kind in the market have appearances with protruding and nonuniform particles and even have skip plating in local parts. The chemical silvering solution has a longer time for starting decomposition than the silvering solutions of the same kind in the market and is more stable.

Description

technical field [0001] The invention belongs to the field of electroless plating, in particular to an electroless silver plating solution and a silver plating method. Background technique [0002] Since silver has good solderability, weather resistance and electrical conductivity, the use of electroless silver plating to protect copper substrates has been widely used in the printed circuit board industry. At present, there are two methods of copper-based electroless silver plating commonly used: 1. Redox chemical silver plating method; 2. Displacement chemical silver plating method. Due to redox silver plating, an additional reducing agent needs to be added, which makes the electroless silver plating solution easily unstable, and when used, it is necessary to carry out corresponding sensitization pretreatment on the metal substrate, and the production cost is high, which hinders its industrial application. Because of its wide application, displacement electroless silver pla...

Claims

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Application Information

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IPC IPC(8): C23C18/42
CPCC23C18/1689C23C18/42
Inventor 董有军
Owner BYD CO LTD
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