Semiconductor memory card, printed circuit board for memory card and method of fabricating the same

A technology for printed circuit boards and memory cards, applied in the field of memory cards, can solve problems such as reducing the yield of memory cards 10, and achieve the effects of preventing abnormal plating, reducing raw material costs, and reducing gold thickness

Inactive Publication Date: 2015-02-04
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, since the terminal part 11 has a connector function with respect to external electronic equipment, if a defect such as a scratch or mark is formed on the terminal part 1, the yield of the memory card 10 may be reduced.

Method used

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  • Semiconductor memory card, printed circuit board for memory card and method of fabricating the same
  • Semiconductor memory card, printed circuit board for memory card and method of fabricating the same
  • Semiconductor memory card, printed circuit board for memory card and method of fabricating the same

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Embodiment Construction

[0040] The embodiments will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily use the embodiments. However, these embodiments may not be limited to the embodiments described below, but may have various modifications.

[0041] In the following description, when a predetermined component “includes” a predetermined component, the predetermined component does not exclude other components but may also include other components, and unless otherwise specified.

[0042] The thickness and size of each layer shown in the drawings may be exaggerated, omitted, or schematically drawn for convenience or clarity. Also, the size of elements does not utterly reflect an actual size. Throughout the drawings, the same reference numerals refer to the same elements.

[0043] In the description of embodiments, it will be understood that when a layer, film, region or panel is referred to as being "on" another layer, film, region or panel,...

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Abstract

A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Description

technical field [0001] Embodiments relate to memory cards, and more particularly, to memory cards in which surface treatment of terminal parts and mounting parts can be performed simultaneously by using the same metal layer, printed circuit boards for memory cards, and methods of manufacturing the same. Background technique [0002] Memory cards are used as storage devices for various electronic devices such as PDAs, digital cameras, or video cameras. [0003] figure 1 is a view showing one surface of a memory card according to the prior art. [0004] refer to figure 1 , in the memory card 10, a semiconductor device includes a memory device mounted on a printed circuit board of the memory card, and the mounted semiconductor device is sealed with a resin molded part. Furthermore, a terminal part 11 is formed on one surface of the memory card to serve as a connector for electrically connecting the memory card to an electronic device using the memory card. [0005] On the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H05K1/18
CPCH05K2201/032H05K2201/0338C25D3/16H05K3/244C23C18/00H05K2203/049C25D3/14C25D5/12H05K1/117G06K19/077H05K1/11H05K2201/0104C25D5/022H05K1/05H05K2201/10159H01L2224/48091H01L2224/45144C25D5/627C25D5/615C25D5/617C25D5/605C25D5/611C25D3/18H01L2924/00014H01L2924/00H05K1/18H05K1/181
Inventor 林雪熙
Owner LG INNOTEK CO LTD
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