Double-faced thick copper plate, manufacturing method thereof and clamp

Abstract

The invention discloses a double-faced thick copper plate, a manufacturing method thereof and a clamp. The first face and the second face of the double-faced thick copper plate are both provided with anti-skid areas; the anti-skid areas are located at the side parts of the first face and the second face; the position of the anti-skid area on the first face is corresponding to the position of the anti-skid area on the second face; and multiple concave parts are arranged in the anti-skid area. As the anti-skid areas are arranged on the double-faced thick copper plate, the improved clamp is matched for clamping the anti-skid area positions of the double-faced thick copper plate, the anti-skid areas are provided with concave parts, the clamp is provided with convex points, the convex points are embedded in the concave parts, the clamping force of the clamp is greatly enhanced, and when the clamp is adopted to clamp the double-faced thick copper plate, the double-faced thick copper plate can be prevented from falling during the electrostatic spraying process.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a double-sided thick copper board, a manufacturing method thereof and a fixture. Background technique [0002] Printed circuit boards, the basic electronic components in the electronics industry, are widely used in automobiles, home appliances, communications, medical and military fields. Among printed circuit boards, double-sided thick copper plates are used as automotive electronic components, especially in high-power and high-voltage parts such as engine power supply parts and automotive central electrical power supply parts. The market demand is increasing day by day. In order to meet the high requirements of the double-sided thick copper plate for solder mask production, the double-sided thick copper plate with better green oil coating thickness uniformity is often used for solder mask coating. [0003] However, the weight of the double-sided thick copper cir...

AI Technical Summary

Problems solved by technology

[0003] However, the weight of the double-sided thick copper circuit board is relatively large, and the double-sided thick copper board is easy to fall from the electrostatic spraying jig during the solder mask coating process.

Especially in the process of circuit board rotation, it is very easy to drop, resulting in rework, scratches or even scrapping of circuit boards, and damage to expensive electrostatic spraying equipment, resulting in greater losses

Images