Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Filter with multilayered structure

A multi-layer structure and filter technology, applied in the filter field, can solve the problems of large size and achieve the effect of small size

Inactive Publication Date: 2015-01-28
史伟立
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the planar structure of this filter, its size is relatively large, which cannot meet the actual needs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0006] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. the embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0007] An embodiment of the present invention provides a multilayer structure filter, including a ceramic substrate composed of six layers of LTCC, the top layer of the ceramic substrate is a microstrip line layer on which the first resonator and the fourth resonator are placed; The bottom layer of the ceramic substrate is a microstrip line layer on which the second resonator and the third resonator are...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a filter with multilayered structure. The filter with multilayered structure comprises a ceramic base plate composed of six layers of LTCC, the top layer of the ceramic base plate is the microstrip line layer provided with a first resonator and a fourth resonator; the bottom layer of the ceramic base plate is the microstrip line layer provided with a second resonator and a third resonator; the middle layer of the ceramic base plate is the ground layer. According to the filter with multilayered structure, the gamma / 4 transmission line and open-loop resonator are formed on the upper layer and lower layer and the size of each part is designed reasonably, the size of the filter is smaller while the performance is not changed.

Description

technical field [0001] The invention relates to the field of filters, in particular to a filter with a multi-layer structure. Background technique [0002] Traditionally, half-wavelength microstrip resonators are often used to design microwave filters. However, due to the periodic resonance principle of the half-wavelength transmission line, the filter with this structure has an inherent disadvantage that its parasitic passband is usually located at twice the frequency of its operating frequency. In order to overcome this defect, a planar structure filter composed of a λ / 4 transmission line and an open-loop resonator is usually used. Since the secondary parasitic passbands of the λ / 4 transmission line resonator and the open-loop half-wavelength resonator are respectively located at the third and second multiplications of their operating frequency, the spurious passband of the filter frequency response extends to its The triple frequency doubling of the working frequency br...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01P1/203H01P7/08
Inventor 史伟立
Owner 史伟立
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products