A kind of low-melting point thermally bonded polyamide fiber filament and its preparation method

A polyamide fiber and thermal bonding technology, which is applied in the direction of single-component copolyamide artificial filament, melt spinning method, artificial filament heat treatment, etc., can solve the problem of low melting point thermal bonding fiber with insufficient strength and easy molecular structure Changes, poor uniformity of dyeing and coloring, etc., to achieve the effect of eliminating post-processing, easy bonding, and simple methods

Active Publication Date: 2016-03-16
HUBEI PROVINCE YU TAO SPECIAL FIBER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conventional spinning can only spin as-spun silk (undrawn silk), and the output of the machine is low. If it is not drawn in time, the molecular structure will easily change, and the silk cake will be deformed and adhered to each other. It cannot be used directly, and it must be drawn. Only after the use requirements are met
When drawing, it will be difficult to unwind the primary silk, the yield rate is low, the loss is large during the drawing process, and the uniformity of dyeing and coloring is poor.
[0004] The application number is 200910029633.4, which discloses the production method of low-melting point thermal bonding fiber. It uses the copolyamide described in this patent as raw material and spinning method to spin a copolyamide filament fiber with a melting point of 80-150°C. The strength of the obtained low melting point thermal bonding fiber is not high enough

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The present invention also provides a method for preparing the above-mentioned low-melting-point thermally bonded polyamide fiber filament, which includes the following steps:

[0027] Using copolyamide chips with a melting point of 75-95°C as raw material, they are extruded by a screw, and after side blowing, they are oiled to absorb moisture and enter the tunnel, and then pass through the first hot roller with a speed of 2150-2850m / min and a speed of 3200-4200m / min. 1.47-2.6 times the draft between the second heating roller and the third heating roller with a speed of 4200-5500m / min to obtain filaments;

[0028] Among them, the screw temperature during the screw extrusion process is 120-205°C, the temperature of the first heating roller is 50-80°C during the drawing and shaping process, the temperature of the second heating roller is 60-90°C, and the temperature of the third heating roller It is 80-110°C.

[0029] The invention provides a method for preparing low-melting th...

Embodiment 1

[0038] Using copolyamide chips with a melting point of 75°C as raw material, the raw material is dried at 50°C for 12 hours under the condition of a vacuum of -0.12Mpa;

[0039] Then the raw material is extruded by a screw, oiled and absorbed by the side blowing into the tunnel, and then passed through the first heat roller with a speed of 2150m / min, the second heat roller with a speed of 3200m / min and the third heat roller with a speed of 4500m / min. After 2.09 times of drafting between the rollers, fiber filaments are obtained;

[0040] Among them, the screw temperature during the screw extrusion process is 120-185°C, the temperature of the first heating roller is 55°C, the temperature of the second heating roller is 65°C, and the temperature of the third heating roller is 85°C during the drawing and setting process;

[0041] During the preparation method of the low melting point thermally bonded polyamide fiber filament, the ambient air and side air blowing temperature are both 20°...

Embodiment 2

[0044] Using copolyamide chips with a melting point of 75°C as raw material, the raw material is dried at 50°C for 12 hours under the condition of a vacuum of -0.12Mpa;

[0045] After passing through the first heating roller with a speed of 2250m / min, the second heating roller with a speed of 3200m / min and the third heating roller with a speed of 4200m / min, the filament is drawn by 1.86 times.

[0046] Among them, the screw temperature during the screw extrusion process is 120-185°C, the temperature of the first heating roller is 60°C, the temperature of the second heating roller is 70°C, and the temperature of the third heating roller is 90°C;

[0047] During the preparation method of the low melting point thermally bonded polyamide fiber filament, the ambient air and side air blowing temperature are both 18°C ​​and the humidity is 80%.

[0048] The obtained low-melting thermal bonding copolyamide fiber filament has a melting point of 75° C., a strength of 3.0 cN / dtex, an elongation r...

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Abstract

The invention relates to the field of low-melting-point heat-bonded fibers, in particular to a low-melting-point heat-bonded polyamide fiber filament, and a preparation method therefor. The melting point of the low-melting-point heat-bonded polyamide fiber filament ranges from 75 DEG C to 95 DEG C, the strength ranges from 3.0 centinewtons per decitex to 4.5 centinewtons per decitex, and the elongation ranges from 30 percent to 40 percent. The preparation method comprises the following steps: copolyamide chips with the melting point ranging from 75 DEG C to 95 DEG C are used as raw materials, enter a channel after sequentially going through screw extrusion, cross air blasting, oil finishing and moisture absorption, and sequentially go through 1.47 to 2.6 times of drafting through first hot rollers, second hot rollers and third rollers to obtain the filter filament. The method provided by the invention has the advantages that copolyamide with a specific melting point serves as the raw materials, the one-step technique of FDY (fully drawn yarn) spinning, drafting and sizing is adopted, and the fiber filament is obtained after spinning, drafting and sizing sequentially through the three pairs of hot rollers (the six hot rollers) with different temperatures; the method is simple, and the prepared low-melting-point heat-bonded polyamide fiber filament has a low melting point and high strength, so that the production requirements can be well satisfied.

Description

Technical field [0001] The invention relates to the field of low-melting thermal bonding fibers, in particular to a low-melting thermal bonding polyamide fiber filament and a preparation method thereof. Background technique [0002] The existing low melting point thermal bonding fibers are mainly spun from different raw materials such as polyamide (PA), polyester (PET), polyethylene (PE), polypropylene (PP), etc. The low melting point thermal bonding fibers include short fibers and The difference between filaments; there is also a difference between the core composite fiber and 100% low melting point fiber. The so-called skin-core composite fiber, the melting point of the skin layer is 150-180℃, which only accounts for 20%, and the core is conventional fiber accounting for 80%. It is difficult to produce and requires special equipment to produce. The product range is very limited; and 100% is low. Melting-point bonding polyamide filaments can replace sheath-core fiber filaments ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D01F6/80D01D5/08D01D5/16D01D10/02D01D5/096
Inventor 殷晃德
Owner HUBEI PROVINCE YU TAO SPECIAL FIBER CO LTD
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