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A method of using thin films to create thermally insulated pipes

A film and pipe technology, applied in the direction of heat insulation protection pipe, pipe protection, heat exchange equipment, etc., can solve the problem of heat insulation material damage, etc., to achieve the effect of improving adsorption force and uniform thickness

Active Publication Date: 2017-04-05
BEIJING HTN PIPELINE EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide a method for manufacturing heat-insulating pipes by using a film to solve the problems caused by the direct contact between the heat-insulating material and the inner wall of the mold liner in the process of producing heat-insulating pipes in the prior art when disassembling the mold. Damage caused by insulation

Method used

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  • A method of using thin films to create thermally insulated pipes
  • A method of using thin films to create thermally insulated pipes
  • A method of using thin films to create thermally insulated pipes

Examples

Experimental program
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Effect test

Embodiment 1

[0041]The mold used in this embodiment is as figure 1 Shown:

[0042] Described mold is split mold and comprises upper mold 1 and lower mold 2, and described upper mold 1 and described lower mold 2 form split mold, and described upper mold 1 and lower mold 2 have shell 11,21 and Corresponding to the shells 11, 21, there are inner tanks 12, 22 with semi-cylindrical cavities installed inside; several through holes 121, 221 are formed on the inner walls of the inner tanks 12, 22, and the inner tanks 12, 22 The outer wall of 22 is provided with cavities 122, 222 communicating with the through holes 121, 221, and at least one of the housings 11, 21 is formed to communicate with the through holes 121, 221 through the cavities 122, 222. The air suction ports 111, 211 are connected to the external vacuum assembly of the mould.

[0043] The through holes 121, 221 are arranged in various ways on the inner tank 12, 22. In this embodiment, the through holes 121, 221 are evenly distribut...

Embodiment 2

[0052] The mold used in this embodiment is a deformation based on the mold in Example 1. The through-hole forming parts are equidistantly arranged along the circumferential direction, and the through-holes 121, 221 are evenly distributed on each of the through-hole forming parts along the axial direction. The liner 12, 22 is provided with several through-hole forming parts equidistantly arranged along the circumferential direction (along the circumferential direction of the mold liner). The holes 121, 221 are axially evenly distributed on each of the through-hole forming parts, such as image 3 As shown, thereby can ensure the pumping effect of the vacuum pumping assembly, make the bag-shaped film 6 and the inner wall of the liner 12,22 adsorb together, and can reduce the chamber 122,222 that communicates with the through hole 121,221 at the same time. The setting area reduces the manufacturing cost of the molding die for the heat insulating layer of the heat insulating pipel...

Embodiment 3

[0055] The mold used in this embodiment is a deformation based on the mold in Example 1. The through-holes 121 , 221 are evenly distributed on the through-hole forming portion along the circumferential direction of the annular through-hole forming portion. The liner 12, 22 is provided with several through-hole forming parts equidistantly arranged along the axial direction (along the length direction of the mold liner), and the through-holes 121, 221 are gathered in the through-hole forming part, and distributed uniformly on each of the via formations, as Figure 4 As shown, thereby can ensure the pumping effect of the vacuum pumping assembly, make the bag-shaped film 6 and the inner wall of the liner 12,22 adsorb together, and can reduce the chamber 122,222 that communicates with the through hole 121,221 at the same time. The setting area reduces the manufacturing cost of the molding die for the heat insulating layer of the heat insulating pipeline and the overall weight of t...

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Abstract

The invention relates to a method for preparing a heat-insulation pipe by films. Through the bag-type films, a heat-insulating material does not directly contact with inner containers of an upper mold and a lower mold so that in mold opening, the inner containers can be separated from the heat-insulating material well and thus the heat-insulating material is protected from damage and the bag-type film can well cover the whole heat-insulating layer surface. A vacuum-pumping assembly is used for air exhaust from a through hole so that the bag-type films are respectively adsorbed on the inner walls of the inner containers of the upper mold and the lower mold under the action of negative pressure and thus the films tightly cling to the inner walls of the inner containers, and in liquid heat-insulating material injection, the films do not wrinkle because of heat-insulating material adhesion to the films and surface thickness of the heat-insulating material is more uniform.

Description

technical field [0001] The invention relates to a method for manufacturing a heat-insulating pipeline by using a film, and belongs to the field of heat-insulating pipeline manufacturing. Background technique [0002] In the fields of central heating, cooling, and oil and gas, the medium conveying pipeline generally adopts adiabatic pipeline, and its structure includes a medium conveying pipe, a casing and an insulating layer between the medium conveying pipe and the casing. Wherein, the medium conveying pipe and the casing can be made of polymer or metal, and the heat insulation layer can be a layer of foam heat insulation material, such as polyurethane foam, or a composite heat insulation layer made of one or more layers of different heat insulation materials. [0003] In the prior art, the mold for manufacturing heat insulating material on the medium conveying pipe, such as the foaming mold described in Chinese patent document CN202656378U, includes an upper mold and a low...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C44/12F16L59/14
Inventor 周抗冰蔡能韩成鹏
Owner BEIJING HTN PIPELINE EQUIP
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