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Resistor element suction device of chip mounter and chip mounter

A technology of resistive components and placement machines, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of only absorbing components and not being able to adjust the orientation of components, so as to achieve high work efficiency, ensure stability, improve production capacity and production efficiency Effect

Inactive Publication Date: 2015-01-14
广东田津电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved in the present invention is to solve the problem that the component pickup device of the existing placement machine can only absorb components and cannot adjust the orientation of the component, and provides a pickup resistor component device and a placement machine for a placement machine, which are suitable for picking up resistors Components, not only has the function of absorbing resistance components, but also has the function of adjusting the orientation of resistance

Method used

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  • Resistor element suction device of chip mounter and chip mounter
  • Resistor element suction device of chip mounter and chip mounter
  • Resistor element suction device of chip mounter and chip mounter

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Embodiment Construction

[0028] In the following, specific implementations of the high-efficiency placement machine of the present invention will be described with reference to the drawings.

[0029] Such as Figure 1 to Figure 3 As shown, a device for sucking resistive components of a chip mounter includes at least one nozzle tray 1 (four nozzle trays 1 are provided in this embodiment). The nozzle tray 1 is elongated and is on the nozzle tray 1. A plurality of suction nozzles 11 are installed to suck a plurality of resistive elements 3 (30 suction nozzles are installed on each nozzle plate 1 in this embodiment), and the plurality of suction nozzles 11 are arranged in a row along the length direction of the nozzle plate 1; The timing belt 12 and the rotating gear 13 that make the suction nozzle 11 rotate at a certain angle, the rotation gear 13 and the suction nozzle 11 are arranged in one-to-one correspondence, the rotation gear 13 is fixed to the corresponding suction nozzle 11, and the timing belt 12 a...

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Abstract

The invention relates to a resistor element suction device of a chip mounter and the chip mounter and relates to the technology for attaching resistor elements to a printed circuit board. The resistor element suction device of the chip mounter comprises at least one suction nozzle disc which is of a strip shape. Multiple suction nozzles are installed on each suction nozzle disc so as to suck multiple resistor elements and the suction nozzles are arranged in a row in the length direction of each suction nozzle disc. The resistor element suction device is further provided with synchronous belts and rotating gears, wherein the suction nozzles are rotated by a certain angle through the synchronous belts and the rotating gears. The rotating gears correspond to the suction nozzles one to one and are fixedly arranged on the corresponding suction nozzles. The synchronous belts correspond to the suction nozzle discs one to one. Each rotating gear is meshed with the corresponding synchronous belt. The moving direction of each synchronous belt is parallel to the length direction of the corresponding suction nozzle disc. The resistor element suction device is suitable for sucking the resistor elements and has the resistor element suction function and the resistor direction adjusting function, resistor element suction operation and resistor direction adjusting operation are completed, the work efficiency is high, and capacity is large.

Description

Technical field [0001] The invention relates to the technology of mounting resistance elements on printed circuit boards, in particular to a resistance element absorption device of a placement machine and a placement machine. Background technique [0002] The placement machine is a device that mounts components such as resistors, capacitors, and light-emitting diodes (LED lamp beads) on a printed circuit board. The placement machine generally includes a board feeding mechanism for transporting circuit boards, a placement mechanism for mounting components, and a transporting component mechanism. For the LED placement machine, the role of the placement mechanism is to mount the LED components and resistance components on the printed circuit board. An important component in the placement mechanism is the device for picking up resistance components. Since the shape of the resistor is different from the LED lamp bead, the shape of the LED lamp bead is circular, which is a centrally ...

Claims

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Application Information

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IPC IPC(8): H05K3/30
CPCH05K3/30
Inventor 梅晓鸿吴伟斌邱瑞新
Owner 广东田津电子技术有限公司
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