Particle Monitoring Method for Wet Cleaning Process Equipment
A technology for wet cleaning and process equipment, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as difficulty in taking into account high sensitivity and accuracy
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[0024] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
[0025] The particle monitoring method for wet cleaning process equipment according to a preferred embodiment of the present invention includes: immersing a part of the wafer area of the wafer into the chemical solution in the acid tank, and exposing another part of the wafer area of the wafer to the chemical solution in the acid tank solution (that is, not immersed in the chemical solution); a part of the wafer area immersed in the chemical solution of the acid bath is cleaned by simulating the cleaning process; after performing the cleaning, the entire wafer (that is, the part of the wafer area and The other part of the wafer area) executes a film growth process; detects defects on the wafer after performing the film growth process, and judg...
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