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Integrated LED element with epitaxial structure and packaging substrate which are integrated, and manufacturing method thereof

A technology of epitaxial structure and packaging substrate, which is applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., to achieve high power density and lower thermal resistance

Active Publication Date: 2014-12-03
JADE BIRD DISPLAY SHANGHAI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To meet the further requirements of LED lighting for high power density, high output luminous flux, high effective service life, and low manufacturing cost, Figure 1A as well as Figure 1B The prior art LED components have inherent developmental limitations

Method used

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  • Integrated LED element with epitaxial structure and packaging substrate which are integrated, and manufacturing method thereof
  • Integrated LED element with epitaxial structure and packaging substrate which are integrated, and manufacturing method thereof
  • Integrated LED element with epitaxial structure and packaging substrate which are integrated, and manufacturing method thereof

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Embodiment Construction

[0089] Therefore, an integrated LED element combined with an epitaxial structure and a packaging substrate of the present invention and its manufacturing method can effectively reduce the manufacturing process of LED elements, save materials, reduce costs, and effectively reduce the layer-by-layer heat conduction of LED elements. resistance, improve the characteristics of the LED element, and solve the problems of the prior art.

[0090] see Figure 2A and Figure 2B , Figure 2A as well as Figure 2B The structure schematic diagrams of the LED epitaxial structure, the LED package and its arrangement on the bare empty carrier and the LED heat dissipation and heat conduction elements shown in the integrated LED element of the present invention are respectively shown. According to a specific embodiment, the LED element 2 integrated with the epitaxial structure and the packaging substrate of the present invention can be embedded in a bare empty area 301 of a bare empty carrier...

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Abstract

The invention discloses an integrated LED element with an epitaxial structure and a packaging structure which are integrated, and a manufacturing method thereof. The integrated LED element is an independent and integrated member which is obtained through forming the epitaxial structure, electrodes and leads of the LED are directly on a substrate. The LED element has a polycrystalline module structure or a monocrystalline structure. The LED element can be inserted into a bare and empty bearing member. Furthermore through the supporting of the bare and empty bearing member, the lower surface of the substrate of the LED element can be directly placed on and contacts with a heat-conductive element or heat radiating element. The LED element is an independent element which is directly manufactured on and cut from a wafer. The structure of the LED element can be a vertical structure or a transverse structure according to different manufacturing modes.

Description

technical field [0001] The present invention relates to an integrated LED element that combines an epitaxial structure and a packaging substrate and a manufacturing method thereof, in particular, relates to directly using the carrying substrate carrying the LED epitaxial structure as a packaging substrate, and packaging the original LED grain The process completes the LED element on the substrate, so that the substrate can be directly placed and contacted with a heat conduction or heat dissipation element when the LED element is applied. The integrated LED element is manufactured directly on the wafer and then cut to become an independent element, and LED elements with a vertical structure or a horizontal structure can be produced according to different processes. Background technique [0002] For the LED lighting industry, the general product and industrial division of labor mode is to separate the production of LED grains and LED packaging into two completely independent p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/62
CPCH01L2224/73267H01L2924/181H01L2224/19H01L2224/24137H01L2224/2518H01L2224/32225H01L2224/32245H01L2224/48091H01L2924/00014H01L2924/00012
Inventor 陈振贤
Owner JADE BIRD DISPLAY SHANGHAI LTD
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