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Lead-free solder alloy tin soldering paste

A technology of lead-free solder alloy and solder paste, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problem of high cost, achieve cost-effectiveness improvement, lower production cost, and provide the effect of soldering effect

Inactive Publication Date: 2014-11-26
XIAN SANWEI SECURITY TECH
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AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. Instead, the use of low-silver solder alloys is the development trend of lead-free electronic assembly to improve cost performance. In the existing market, there are solder pastes based on SAC305, but the disadvantage is that the cost is relatively high. Therefore, it is urgent to reduce the amount of silver in the solder alloy. Ag content, thereby improving the cost performance of the assembly process

Method used

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Embodiment Construction

[0009] A kind of lead-free solder alloy solder paste according to the present invention is characterized in that it is formed by uniform stirring and mixing of lead-free solder alloy powder and flux in a ratio of 11:89; the flux composition includes 35% rosin, solvent 31%, organic acid activator 8%, thixotropic agent 4.5%, viscosity regulator 14% and antioxidant 7.5%; described lead-free solder alloy powder is Sn-1.0Ag-0.5Cu.

[0010] A kind of lead-free solder alloy solder paste according to the present invention is characterized in that the rosin includes common rosin, hydrogenated rosin and polymerized rosin; the solvent includes ethanol, toluene and petroleum ether; the antioxidant is a phenolic compound, Including dibutyl hydroxytoluene and t-butyl hydroquinone.

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Abstract

The invention relates to lead-free solder alloy tin soldering paste and belongs to the field of tin soldering paste preparing in a chemical mode. The lead-free solder alloy tin soldering paste is characterized by being formed by lead-free solder alloy powder and scaling powder in an evenly-stirring-mixing mode according to the proportion of 11 : 89. Components of the scaling powder comprise 35% of rosin, 31% of solvents, 8% of organic acid active agents, 4.5% of thixotropic agents, 14% of viscosity modifiers and 7.5% of antioxidants. Solder alloy powder is effectively improved, so that production cost is effectively lowered, meanwhile, soldering aiding effect can be well provided, the cost performance is greatly improved, and the lead-free solder alloy tin soldering paste can be promoted and produced in a large scale under the current technology production conditions.

Description

technical field [0001] The invention belongs to the field of chemical preparation of solder paste, in particular to a lead-free solder alloy solder paste. Background technique [0002] With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. The traditional solder paste is gradually replaced because it contains a lot of lead and generates a lot of smoke and dust. The use of low-silver solder alloys is an improvement in lead-free electronic assembly. The development trend of cost performance. In the existing market, there are solder pastes based on SAC305, but its disadvantage is that the cost is relatively high. Therefore, it is urgent to reduce the Ag content in the solder alloy to improve the cost performance of the assembly process. Contents of the invention [0003] The invention aims to provide a lead-free solder alloy solder paste which can effectively reduce the production c...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/362
Inventor 贾卫东魏军锋
Owner XIAN SANWEI SECURITY TECH
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