Lead-free solder alloy tin soldering paste
A technology of lead-free solder alloy and solder paste, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problem of high cost, achieve cost-effectiveness improvement, lower production cost, and provide the effect of soldering effect
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[0009] A kind of lead-free solder alloy solder paste according to the present invention is characterized in that it is formed by uniform stirring and mixing of lead-free solder alloy powder and flux in a ratio of 11:89; the flux composition includes 35% rosin, solvent 31%, organic acid activator 8%, thixotropic agent 4.5%, viscosity regulator 14% and antioxidant 7.5%; described lead-free solder alloy powder is Sn-1.0Ag-0.5Cu.
[0010] A kind of lead-free solder alloy solder paste according to the present invention is characterized in that the rosin includes common rosin, hydrogenated rosin and polymerized rosin; the solvent includes ethanol, toluene and petroleum ether; the antioxidant is a phenolic compound, Including dibutyl hydroxytoluene and t-butyl hydroquinone.
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