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Preparation method and application of pressure-sensitive temporary bonding glue

A temporary bonding glue, pressure-sensitive technology, applied in the preparation of microspheres, microcapsule preparations, adhesives, etc., can solve the problems of product reliability and shipping price impact, time-consuming and other problems, to achieve fast inspection, low cost, real-time cost effect

Active Publication Date: 2014-11-05
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Due to some unfavorable factors of these process methods, it has a great impact on the reliability of the product and the shipping price
Various new process methods have also been gradually proposed and discussed, but when silicon wafers are used for loading, these methods all use ultrasonic scanning to detect the quality of temporary bonding, which has disadvantages such as time-consuming

Method used

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  • Preparation method and application of pressure-sensitive temporary bonding glue
  • Preparation method and application of pressure-sensitive temporary bonding glue

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A pressure-sensitive temporary bonding adhesive, the proportion of which is calculated by weight is as follows: 30 parts of solvent, 30 parts of base resin, and 5 parts of microcapsule particles. The base resin is cycloolefin polymer particles with a particle size of 0.2um.

[0032] The solvent is cyclododecene.

[0033] Such as Figure 1-2 As shown, the particle structure of the microcapsule is as follows: the inner core is a polymer compound, the outer layer is wrapped by a continuous wall or outer phase of a natural or synthetic polymer compound, and the outer layer completely covers the inner core.

[0034] The high molecular compound has hydrocarbon polymers of other colors except transparent color, the outer layer is cycloolefin or liposome polymer, and the wall thickness is 0.01-10 μm.

[0035] The preparation method of the pressure-sensitive temporary bonding adhesive, the steps are as follows:

[0036] (1) Preparation of microcapsule particles: Put the inner...

Embodiment 2

[0039] A pressure-sensitive temporary bonding adhesive, the proportion of which is as follows by weight: 70 parts of solvent, 50 parts of base resin, and 30 parts of microcapsule particles. The base resin is cycloolefin polymer particles with a particle size of 20um. The solvent is limonene.

[0040] The pressure-sensitive temporary bonding adhesive also includes a tackifier and a plasticizer; the tackifier is a β-polyterpene resin, and the parts by weight are 5 parts; the plasticizer is a terephthalate, and the parts by weight are for 8 copies;

[0041] Such as Figure 1-2 As shown, the particle structure of the microcapsule is as follows: the inner core is a polymer compound, the outer layer is wrapped by a continuous wall or outer phase of a natural or synthetic polymer compound, and the outer layer completely covers the inner core.

[0042] The high molecular compound has hydrocarbon polymers of other colors except transparent color, the outer layer is cycloolefin or li...

Embodiment 3

[0047] A pressure-sensitive temporary bonding adhesive, the proportion of which is as follows by weight: 50 parts of solvent, 40 parts of base resin, and 25 parts of microcapsule particles. The base resin is cycloolefin polymer particles with a particle size of 15um.

[0048] The solvent is methyl ethyl ketone. Also includes phenolic antioxidant, the weight part is 2 parts.

[0049] Such as Figure 1-2 As shown, the particle structure of the microcapsule is as follows: the inner core is a polymer compound, the outer layer is wrapped by a continuous wall or outer phase of a natural or synthetic polymer compound, and the outer layer completely covers the inner core.

[0050] The high molecular compound has hydrocarbon polymers of other colors except transparent color, the outer layer is cycloolefin or liposome polymer, and the wall thickness is 5 μm.

[0051] The preparation method of the pressure-sensitive temporary bonding adhesive, the steps are as follows:

[0052] (1) P...

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Abstract

The invention relates to preparation method and application of pressure-sensitive temporary bonding glue and belongs to the technical field of microelectronic packaging. A slide glass wafer and a device wafer are bonded in a temporary mode by adopting the pressure-sensitive temporary bonding glue, and microcapsules are broken by utilizing temporary bonding pressure, so that color of the peripheral space changes. If a certain area is hollow, the microcapsules in the area are not broken, the color of the peripheral space does not change, and the aim of directly observing the temporary bonding quality after bonding removal is achieved. According to the method, a low-cost temporary bonding process can be greatly realized, and the reliability of the temporary bonding process is rapidly checked.

Description

technical field [0001] The invention relates to a preparation method and application of a pressure-sensitive temporary bonding adhesive to effectively complete three-dimensional packaging, and belongs to the technical field of microelectronic packaging. Background technique [0002] As the thickness of the packaging structure is further reduced, especially for stacked 2.5DIC and 3DIC technologies, the advantages of thin wafer technology are becoming more and more obvious. Therefore, the processing of thin wafers and thin chips has become the bottleneck of mass production of ultra-thin products. On this basis, temporary bonding and debonding processes are introduced. [0003] Temporary bonding and debonding has the following advantages: First, the carrier wafer provides mechanical support and protection for the thin device wafer so that backside processing can be performed with standard device foundry equipment. For ultra-thin device wafers, wafer-level processing can be ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J145/00C09J165/00C09J201/00C09J11/08B01J13/06H01L21/56
Inventor 姜峰林挺宇顾海洋
Owner NAT CENT FOR ADVANCED PACKAGING
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