Bonding device for realizing binding of two-layer film structure in one-step main bonding

Abstract

The invention discloses a bonding device for realizing binding of a two-layer film structure in one-step main bonding. The bonding device comprises a bonding head body, wherein two sides of the bonding head body correspondently extend downwards to form two side bonding heads, the bonding head body between the two side bonding heads extends downwards to form an intermediate bonding head, the height of the two side bonding heads is different from that of the intermediate bonding head, the height difference among the three bonding heads is matched with the designed height difference of two layers of circuits on a functional plate, the bonding head body is provided with at least one heating point, and the heating point is connected with an electromagnetic heater through a heating wire. The bonding device for realizing the binding of two-layer film structure in one step has the following advantages: 1) the requirement of main bonding on the personnel / equipment can be reduced, and one main bonding for one machine is realized; 2) the main bonding efficiency is increased, the turnover of the material is reduced, and the one-step main bonding is realized; 3) the problem can be discovered in time, and when the main bonding machine is abnormal, the abnormality of the main bonding machine can be discovered in time through the electric test and can be adjusted in time, and the mass functional problem can be avoided.

Description

technical field [0001] The invention relates to a touch screen processing technology, in particular to a pressing device for realizing binding of a double-layer film structure by one-time pressing. Background technique [0002] In the structural design of the touch screen, there is a structural design of GFF (GFF: cover plate + functional sheet with double-layer film structure). This design scheme is very popular in the existing capacitive screen design. In the FPC (flexible circuit) and ITO (functional chip) bonding process of the GFF structure project products, since there are lines on the two membranes, and the lines are not on the same plane, the bonding uses two indenters to pass through twice. The process method of this voltage realizes the connection and conduction between the two. [0003] However, in the specific production process, the use of two indenters to press twice has the following disadvantages: [0004] 1. Need two press machines and two operators; [...

AI Technical Summary

Problems solved by technology

[0004] 1. Need two press machines and two operators;

[0005] 2. The efficiency of the pressure is low. After the first pressure is finished, it is sent to another second pressure.

More turnover, affecting the efficiency of the pressure;

[0006] 3. The problem cannot be found in time. Since the functional test can only be carried out after two pressures are completed, when the first pressure machine is abnormal, it cannot be found in time.

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