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Photocurable thermosetting resin composition, cured product, and printed circuit board

A resin composition, thermosetting technology, applied in the directions of printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problem of inability to perform gold plating, and achieve the effect of excellent touch dryness and high sensitivity

Active Publication Date: 2019-04-26
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When residues are generated, there are problems such as impossibility of gold plating

Method used

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  • Photocurable thermosetting resin composition, cured product, and printed circuit board
  • Photocurable thermosetting resin composition, cured product, and printed circuit board
  • Photocurable thermosetting resin composition, cured product, and printed circuit board

Examples

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Embodiment

[0134] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to the following description. In addition, hereinafter, unless otherwise specified, "parts" and "%" represent "parts by mass" and "% by mass".

[0135] [Synthesis of photosensitive resin]

Synthetic example 1

[0136] Synthesis Example 1: Photosensitive Resin (A1-1)

[0137] Put into 600 g of diethylene glycol monoethyl ether acetate an o-cresol novolak type epoxy resin [DIC Co., Ltd., EPICLON N-695, softening point 95°C, epoxy equivalent 214, average functionality 7.6 ] 1070 g (number of glycidyl groups (total number of aromatic rings): 5.0 mol), 360 g (5.0 mol) of acrylic acid, and 1.5 g of hydroquinone were heated and stirred at 100° C., and dissolved uniformly.

[0138] Next, after throwing in 4.3 g of triphenylphosphine and heating to 110° C. to react for 2 hours, the temperature was raised to 120° C., and the reaction was further performed for 12 hours. 415 g of aromatic hydrocarbons (SOLVESSO 150) and 456.0 g (3.0 moles) of tetrahydrophthalic anhydride were added to the resulting reaction solution, and the reaction was carried out at 110° C. for 4 hours and cooled to obtain a carboxyl group-containing photosensitive resin solution ( A1).

[0139] The solid content (quantity ...

Synthetic example 2

[0140] Synthesis Example 2: Photosensitive Resin (A-1)

[0141] Put into 700 g of diethylene glycol monoethyl ether acetate an o-cresol novolac type epoxy resin [DIC Co., Ltd., EPICLON N-695, a softening point of 95°C, an epoxy equivalent of 214, and an average functionality of 7.6 ] 1070 g (number of glycidyl groups (total number of aromatic rings): 5.0 mol), 360 g (5.0 mol) of acrylic acid, and 1.5 g of hydroquinone were heated and stirred at 100° C., and dissolved uniformly.

[0142] Next, 4.3 g of triphenylphosphine was charged, heated to 110° C., and reacted for 2 hours, and then 1.6 g of triphenylphosphine was further added, and the temperature was raised to 120° C., and the reaction was further performed for 12 hours. 562 g of aromatic hydrocarbons (SOLVESSO 150) and 684 g (4.5 mol) of tetrahydrophthalic anhydride were added to the obtained reaction liquid, and reaction was performed at 110° C. for 4 hours. Furthermore, 142.0 g (1.0 mol) of glycidyl methacrylates were ...

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Abstract

The present invention addresses the problem of providing a light-curing / heat-curing resin composition with high sensitivity to light and minimal generation of development residue even if the drying time is extended before exposure to light, a hardened material comprising the composition, and a printed circuit board having the hardened material. In order to overcome the problem, an embodiment of the present invention provides a light-curing / heat-curing resin composition characterized in containing: (A) a carboxyl-containing photosensitive resin obtained by reacting a multifunctional epoxy resin and a radical-polymerizable unsaturated monocarboxylic acid to generate an epoxy carboxylate having a side-chain hydroxyl, reacting the epoxy carboxylate with a polybasic acid anhydride to generate a carboxyl-containing photosensitive resin (A1), and reacting the carboxyl-containing photosensitive resin (A1) with a compound having an epoxy group and a radical-polymerizable unsaturated group; (B) a multifunctional epoxy resin having a hardening point no higher than 60°C; and (C) a photopolymerization initiator.

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition, a cured product, and a printed wiring board. Background technique [0002] A photocurable resin composition is known as a solder resist material for a printed wiring board. As such a composition, for example, as in Patent Document 1, a composition containing an ultraviolet curable resin, a photopolymerization initiator, a diluent, and a thermosetting resin is disclosed. Moreover, like patent document 2, the photocurable resin composition for direct exposure which made high sensitivity by containing an oxime ester type photoinitiator is also disclosed. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Laid-Open No. 10-282665 [0006] Patent Document 2: Japanese Patent Laid-Open No. 2011-22328 Contents of the invention [0007] The problem to be solved by the invention [0008] In the photocurable resin c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027C08G59/16G03F7/004H05K3/28
CPCC08G59/1466C08G59/4215C08L63/10G03F7/027G03F7/038G03F7/0388H05K3/287H05K3/3452H05K2201/0145H05K2201/0158H05K2201/0284
Inventor 植田千穗
Owner TAIYO HLDG CO LTD
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