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Integrated parallel optical assembly and optical transceiver module

A technology of optical components and optical paths, which is applied in the field of optical communication, can solve the problems of increasing the electrical parasitic effect of optical components, limiting the transmission rate of the system, and high manufacturing costs, and achieves the effects of reducing electrical parasitic effects, simple process, and low cost

Inactive Publication Date: 2014-10-22
SHENZHEN NEOPHOTONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This scheme adopts more components, the process is more complicated, and the manufacturing cost is high
The use of flexible circuit boards and longer electrode leads also greatly increase the electrical parasitic effect of optical components, limiting the transmission rate of the system

Method used

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  • Integrated parallel optical assembly and optical transceiver module
  • Integrated parallel optical assembly and optical transceiver module
  • Integrated parallel optical assembly and optical transceiver module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Such as figure 1 and figure 2 As shown, the integrated parallel optical component of this embodiment includes a circuit board 1 , a transparent substrate 2 , a 90-degree optical path bending connector 3 , a laser array 4 , a driver 5 , a photodetector array 6 and a transconductance amplifier 7 . Both the laser array 4 and the photodetector array 6 are four parallel arrays. The laser in this embodiment is a vertical cavity surface emitting laser (VCSEL).

[0028] The first side 11 of the circuit board 1 is arranged with an electrode array 8, and the VCSEL array 4, driver 5, photodetector array 6 and transconductance amplifier 7 are mounted on the first side of the circuit board 1 in a flip-chip bonding manner. side 11 and is electrically connected to the electrode array 8 . The arrangement of the VCSEL array 4, driver 5, photodetector array 6 and transconductance amplifier 7 on the circuit board 1 is as follows: figure 2 shown. In this embodiment, a lens 23 is pro...

Embodiment 2

[0032] The difference between this embodiment and the first embodiment is that the light transmission device provided on the circuit board 1 is realized by using a transparent substrate.

[0033] Such as figure 2 and image 3 As shown, the integrated parallel optical component of this embodiment includes a circuit board 1 , a transparent substrate 2 , a 90-degree optical path bending connector 3 , a laser array 4 , a driver 5 , a photodetector array 6 and a transconductance amplifier 7 . Both the laser array 4 and the photodetector array 6 are four parallel arrays. The laser in this embodiment is a vertical cavity surface emitting laser (VCSEL).

[0034]The first side 11 of the circuit board 1 is arranged with an electrode array 8, and the VCSEL array 4, driver 5, photodetector array 6 and transconductance amplifier 7 are mounted on the first side of the circuit board 1 in a flip-chip bonding manner. side 11 and is electrically connected to the electrode array 8 . The arr...

Embodiment 3

[0039] This embodiment is a parallel optical transceiver module using any one of the integrated parallel optical components described in Embodiment 1 or Embodiment 2. Preferably, the integrated parallel optical component of Embodiment 2 is used.

[0040] The integrated parallel optical transceiver module of this embodiment includes a circuit substrate, a housing, a parallel optical fiber pluggable interface and an integrated parallel optical component. Both the circuit substrate and the integrated parallel optical components are packaged in the housing. The circuit substrate is electrically connected to the integrated parallel optical module, and the electrical interface of the parallel optical module adopts gold finger electrodes. Both the VCSEL array 4 and the photodetector array 6 of the present embodiment are 4-way, and the parallel optical fiber pluggable interface is 12 channels, wherein 4 channels are coupled with 4 VCSEL coupling pairs of the VCSEL array 4 of the integ...

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PUM

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Abstract

The invention discloses an integrated parallel optical assembly which includes a circuit board, a transparent substrate, a 90-degree optical path bending connector, a laser device array, a driver, an optical detector array and a transconductance amplifier. One side of the circuit board is provided with an electrode array. A photoelectric device and a chip are installed onto the circuit board in the manner of back bonding. The circuit board is provided with a light-penetrable device. One side of the transparent substrate is attached onto the circuit board. The 90-degree optical path bending connector is attached onto the other side of the transparent substrate. The 45-degree mirror surface of the 90-degree optical path bending connector is coupled and aligned with the photoelectric device. The invention further discloses an integrated parallel optical transceiver module adopting the above optical assembly. The integrated parallel optical assembly of the invention has advantages of convenient integration, increased bandwidth density, simple coupling structure and low cost. According to the invention, all assembly processes can be performed in the wafer state, and then cutting cleavage is performed to form an optical assembly, the optoelectronic integration scheme has advantages of simple process and large-scale production.

Description

technical field [0001] The invention relates to the field of optical communication, in particular to an integrated parallel optical component and an optical transceiver module. Background technique [0002] The increase of cloud computing, online video, voice over IP and other Internet applications has led to an increase in the information flow of enterprise networks, LAN and SAN networks, and telecommunication networks. The growth of server virtualization and cloud computing, coupled with the trend towards network integration, has created a greater need for faster and more efficient data center networks. The cloud computing network pushes the application processing on the client side to the data center, and the application is processed in a distributed manner by multiple servers, that is, parallel CPUs perform distributed operations. In order to effectively utilize these distributed CPU resources, it is necessary to provide a flat network with rich connections between serv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/43H04B10/40
Inventor 侯小珂张胜利王雷
Owner SHENZHEN NEOPHOTONICS TECH
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