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A light-weight, high-efficiency, heat-dissipating LED lamp

A technology of LED lamps and LED lamp substrates, applied in lighting and heating equipment, parts of lighting devices, semiconductor devices of light-emitting elements, etc., can solve the problems of low heat dissipation efficiency of heat radiation, complex heat convection structure, and inability to dissipate heat, etc. , to achieve the effects of improving heat conduction, reducing support strength and production costs, improving service life and aesthetics

Active Publication Date: 2016-08-24
梁蔚豪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, there are various problems in the above-mentioned scheme. A large number of heat conductors must be used for heat conduction. The heat conductor is mainly made of metal. Even if aluminum with good thermal conductivity and light weight is used, its weight is still large and the manufacturing cost is relatively high.
The heat dissipation efficiency of heat radiation is low, and the heat cannot be dissipated in time. The heat convection structure is complex, the processing is difficult, and the circuit is large, which increases power consumption.

Method used

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  • A light-weight, high-efficiency, heat-dissipating LED lamp
  • A light-weight, high-efficiency, heat-dissipating LED lamp
  • A light-weight, high-efficiency, heat-dissipating LED lamp

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Embodiment 1

[0045] Such as Figure 1~5 As shown, this embodiment is a light-weight and efficient heat-dissipating LED lamp for street lamps, including a lamp holder 1, an LED lamp substrate 2 and a radiator 3, the lamp holder 1 is connected to the radiator 3, and the lamp holder 1 is provided with a connector 5 connected to the outside world, the LED lamp substrate 2 is provided with a plurality of LED lamps, and the heat sink 3 is provided with 8 heat dissipation channels 31, and a part of the heat dissipation channels is composed of The LED lamp substrate 2 is formed, and the other parts are formed by the first heat conduction layer 34. The material of the first heat conduction layer 34 is aluminum alloy, and the thickness of the first heat dissipation layer 34 is 0.3 mm. In actual use, The first heat dissipation layer 34 is located above the LED lamp substrate 2, and the heat dissipation channel 31 is provided with an air inlet 32 ​​and an air outlet 33, and the distribution density of...

Embodiment 2

[0050] Such as Figure 8 to Figure 9 As shown, this embodiment is a bulb-shaped LED lamp with light weight and high efficiency of heat dissipation, including a lamp holder 1, an LED lamp substrate 2 and a radiator 3, the lamp holder 1 is connected to the radiator 3, and the lamp holder 1 is provided with a connector 5 connected to the outside world, the LED lamp substrate 2 is provided with a plurality of LED lamps, and the heat sink 3 is provided with a heat dissipation channel 31, and the heat dissipation channel 31 is all composed of LED Enclosed by the lamp substrate 2 , the heat dissipation channel 31 is provided with an air inlet 32 ​​and an air outlet 33 , and the distribution density of LED lamps gradually decreases along the air inlet 32 ​​to the air outlet 33 of the heat dissipation channel 31 . In the state of use, the air inlet 32 ​​is located at the lower side of the heat dissipation passage 31 , and the air outlet 33 is located at the upper side of the heat dissi...

Embodiment 3

[0054] Such as Figure 10 As shown, it is roughly the same as Embodiment 2, the difference is that a second heat conduction layer 35 is added at the place where the LED lamp substrate 2 is close to the heat dissipation channel 31, which is beneficial to mold processing. During the installation process, only the LED lamp needs to be It only needs to adhere the substrate 1 on the second heat conducting layer 35 . The material of the second heat conduction layer 35 is aluminum alloy, and the thickness of the second heat conduction layer 35 is 0.8mm.

[0055] This embodiment is not limited to bulb-shaped LED lamps, and can also be applied to LED lamps used for street lamps. For the sake of brevity, this embodiment will not be described in detail one by one, but its principle is the same as this embodiment .

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Abstract

The invention discloses a light-weight and high-efficiency heat-dissipating LED lamp, which comprises a lamp holder, an LED lamp base plate and a heat sink, the lamp base is connected with the heat sink, and at least one LED lamp is arranged on the LED lamp base plate. The radiator is provided with at least one heat dissipation channel, at least a part of the heat dissipation channel is formed by the LED lamp substrate, and the heat dissipation channel is provided with an air inlet and an air outlet. The present invention aims to provide a light-weight, high-efficiency, heat-dissipating LED lamp with rapid heat dissipation, simple structure and light weight.

Description

technical field [0001] The invention relates to the field of LED lighting lamps, in particular to a light-weight, high-efficiency, heat-dissipating LED lamp. Background technique [0002] LED lights have become a widely used light source because of their energy saving, durability, small size and environmental protection. When the LED lights are gathered together, if the heat cannot be dissipated in time, the junction temperature of the LED lights will increase significantly, which will result in reduced luminous efficiency and shortened service life of the LED lights. [0003] In order to solve this problem, various solutions have been proposed in the industry, and the following three are commonly used: [0004] 1. Heat conduction, that is, the heat is exported to the low-temperature environment through the heat conductor. The more commonly used means include setting heat dissipation fins, or supplementing the heat dissipation fins with low-temperature refrigerants to take ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V29/83F21V29/89F21V29/60F21V19/00F21Y115/10F21K9/237
Inventor 梁蔚豪
Owner 梁蔚豪
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