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Package for housing electronic components and electronic device

A technology of electronic components and electronic devices, applied in the direction of circuit heating devices, printed circuit components, electrical components, etc., can solve the problems of difficult heat dissipation, difficult correction of substrate bending, easy deformation of screw fixing parts, etc., to achieve easy heat dissipation and increased area Effect

Inactive Publication Date: 2017-02-22
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the package described in Patent Document 1, since the screw fixing portion is easily deformed, it is difficult to correct the curvature of the base.
In the case where the base body is bowed upward or downward, the lower surface of the base body and the external substrate cannot adhere to each other in a large area.
Then, it becomes difficult to dissipate heat from the base to the external substrate

Method used

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  • Package for housing electronic components and electronic device
  • Package for housing electronic components and electronic device
  • Package for housing electronic components and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Hereinafter, an electronic component housing package 10 and an electronic device 100 according to one embodiment of the present invention will be described with reference to the drawings. It should be noted that the drawings are all schematic. Differs from the actual scale.

[0022] (Structure of package 10 for housing electronic components)

[0023] figure 1 It is a perspective view which shows the electronic component housing package 10 which concerns on one Embodiment of this invention. Such as Figure 1~5 As shown, an electronic component housing package 10 according to an embodiment of the present invention includes a case 1 having an opening on the upper surface, and a screw fixing portion 31 extending laterally from the case 1 . One end of the screw fixing part 31 is fixed on the side surface of the housing 1 . Input / output terminals 2 are fixed to the housing 1 . This input / output terminal 2 becomes a part of the housing 1 . In addition, the frame body 4 ...

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PUM

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Abstract

The package (10) is provided with: a case (1), which mounts an electronic component (5) in a recess (1a) having an opening on the upper surface; and a screw fixing part (31), which is fixed to the case The side of the body (1) and extends towards the side. The screw fixing part (31) has: a thin-walled part (34), which is arranged on the front end side and has a through hole (36) for installing screws; a thick-walled part (35), which is arranged on the thin-walled part (34) and Between the side surfaces of the casing (1), the thickness of the thick-walled portion (35) is thinner than the thickness of the side surface of the casing (1) and thicker than the thickness of the thin-walled portion (34); and the holes for screw connection ( 37), it is arranged on the thick wall part (35) along the up and down direction. Even if the case (1) is bent when the package (10) is fixed to the external substrate, heat dissipation from the package to the external substrate can be improved.

Description

technical field [0001] The present invention relates to a package for housing electronic components and an electronic device. Background technique [0002] As an electronic component storage package (it may only be called a package hereinafter) which accommodates an electronic component, the package described in patent document 1 is known, for example. The package described in Patent Document 1 includes screw fixing portions at four corners for mounting the substrate to the external substrate. [0003] In the package described in Patent Document 1, a stepped portion in which an upper surface on the side of the screw fixing portion is lowered is formed between a portion of the base body to which the case is joined and the screw fixing portion. The thickness of the screw fixing portion formed at the tip of the stepped portion becomes thin. Therefore, when the package is mounted on the external substrate using screws, the screw fixing portion is easily deformed. [0004] pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/04H01L23/02
CPCH01L23/04H01L23/047H05K1/0203H05K3/303H05K2201/10409H05K2201/10628H01L2924/0002H01L23/36H01L23/4006H05K2201/097H01L23/10H01L2924/00H05K7/2039
Inventor 田中信幸高谷茂典
Owner KYOCERA CORP
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