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Electronic device and heat dissipation structure of the electronic device

A technology of heat dissipation structure and electronic device, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as difficult design, and achieve the effect of reducing the area of ​​waterproof area

Active Publication Date: 2017-02-08
SHENXUN COMP KUNSHAN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Thereby making the first shell base 20a more difficult to design during development

Method used

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  • Electronic device and heat dissipation structure of the electronic device
  • Electronic device and heat dissipation structure of the electronic device
  • Electronic device and heat dissipation structure of the electronic device

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Embodiment Construction

[0022] Please refer to Figure 2 to Figure 4 , the present invention discloses a heat dissipation structure 1 . The heat dissipation structure 1 includes a first case base 10 , a heat conduction plate 20 and a heat dissipation fin set 30 . Furthermore, the present invention further discloses an electronic device 2 with a heat dissipation structure 1 . The electronic device 2 includes a second casing 10', a first casing 10, a heat conduction plate 20 and a cooling fin set 30.

[0023] Please refer to image 3 and Figure 4 . One side of the first case base 10 forms a first space 101 . The first space 101 accommodates at least one heating element 11 and at least one heat pipe 12 . One end of the heat pipe 12 is connected to the heating element 11 . The other side of the first housing 10 forms a second space 102 . The first housing 10 defines an opening 100 , and the opening 100 communicates the first space 101 and the second space 102 .

[0024] In one embodiment of the...

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Abstract

The invention provides an electronic device and a heat radiating structure of the electronic device. The heat radiating structure comprises a first casing seat, a heat conducting plate and a heat radiating fin group. A first space is formed on one side of the first casing seat. At least one heating component and at least one heat pipe are accommodated in the first space. One end of the heat pipe is connected with the heating component. A second space is formed on the other side of the first casing seat. The first casing seat is provided with a hole. The hole is communicated with the first space and the second space. The heat conducting plate covers the hole and thermally contacts the other end of at least one heat pipe. The heat radiating fin group is fixed on the heat conducting plate and is accommodated in the second space through the hole. The electronic device comprises a first casing seat, a second casing seat, a heat conducting plate and a heat radiating fin group. The electronic device is applied to the heat radiating structure. According to the invention, the area of a waterproof region can be reduced, and heat radiating can be carried out on the heating component.

Description

[0001] 【Technical field】 [0002] The invention relates to a heat dissipation structure of a heat generating electronic component, in particular to an electronic device and the heat dissipation structure of the electronic device. [0003] 【Background technique】 [0004] Electronic components generate a lot of heat when they are in operation. Therefore, a heat dissipation device is usually installed inside the computer case nowadays to take away the high heat inside the case and prevent the high heat from harming the electronic components. Industrial computers or military computers have a waterproof function to prevent the internal circuits of the computer from being damaged due to moisture in a humid environment. However, the waterproof structure of industrial computers or military computers is not conducive to the heat dissipation of the heat sink. [0005] see figure 1 , depicting a related heat dissipation structure. The heat dissipation structure includes a second shell...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 吴启荣
Owner SHENXUN COMP KUNSHAN
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