Automatic contact instrument used for measuring thin sheet material dimensions

Abstract

The invention provides an automatic contact instrument used for measuring thin sheet material dimensions. The automatic contact instrument comprises a measuring head, a control system comprising a numerical control and calculation module, and a shaft system moving along a three-dimensional coordinate, wherein the measuring head comprises a guide rail die and a guide core, the guide core penetrates through the guide rail die, the guide rail die has an air inlet and an air guide groove, an air guide rail is formed in the guide rail die, a top portion of the guide rail is provided with the air inlet, a bottom portion of the guide rail is connected with a spring, the spring is arranged between the guide core and a bottom board, a lower end of the spring is connected with a probe, a top portion of the guide core is connected with a raster ruler, the raster ruler is connected with a laser displacement sensor, and the laser displacement sensor is connected with the control system. The measuring head of the measuring instrument employs the pneumatic control technology, precise adjustment on a measuring force can be realized through changing internal and external air pressure of the guide core, a value of the measuring force can be not only adjusted, but also the measuring force is guaranteed to be constant; a three-dimensional motion platform is employed in combination with the numerical control technology, all-round and automatic measurement is realized, and thereby measurement precision of surface dimensions of thin sheet material type elements can be improved.

Description

technical field [0001] The invention relates to the technical field of precision measuring equipment, in particular to a contact-type automatic measuring instrument for the size of thin plates. Background technique [0002] In the printed circuit and semiconductor industries, a large number of thin plate components are often used, such as circuit board substrates with a thickness between 0.05mm and 1mm, usually made of stainless steel, nickel alloys, etc., after electroforming, Made by electroplating, polishing, etching and other processes. In these industries, the surface dimensional characteristics of circuit substrates are highly required. Regardless of raw materials, semi-finished products or finished products, professional equipment is required to strictly inspect the flatness and other dimensional accuracy indicators of the substrate surface. [0003] In related technologies, optical equipment is usually used for measurement, calculation is performed by reading light ...

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Problems solved by technology

[0004] In view of the above defects and problems of insufficient measurement accuracy of the existing optical equipment for the surface morphology of thin plate components, the purpose of the present invention is to provide a contact type automatic measurement of thin plate dimensions with higher measurement accuracy and controllable measurement force instrument

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