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Method for determining spacecraft electronic assembly heat cycle test scheme

A technology of electronic components and test plans, applied in the direction of instruments, measuring electricity, measuring electrical variables, etc., can solve problems such as product damage without consideration

Inactive Publication Date: 2014-08-27
BEIHANG UNIV
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Problems solved by technology

[0004] On the other hand, the thermal cycle test scheme is usually analyzed, only considering the effectiveness of the thermal cycle test scheme, that is, the ratio of the number of faults exposed in the test to the total number of faults, without considering the unnecessary damage of the product due to the overstress of the test

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  • Method for determining spacecraft electronic assembly heat cycle test scheme
  • Method for determining spacecraft electronic assembly heat cycle test scheme
  • Method for determining spacecraft electronic assembly heat cycle test scheme

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Embodiment Construction

[0120] In the following, the method for determining the thermal cycle test scheme of the spacecraft electronic component for a specific spacecraft electronic component according to the present invention will be described in detail in combination with specific implementation cases.

[0121] Case: Attitude and orbit control engine parameter acquisition board applied to spacecraft

[0122] The present invention takes an attitude-orbit control engine parameter acquisition board applied to a spacecraft as an example to illustrate a method for determining a thermal cycle test scheme of a spacecraft electronic component for a specific spacecraft electronic component.

[0123] The information and application requirements of the attitude control engine parameter acquisition board are as follows:

[0124] (1) Attitude and orbit control engine parameter acquisition board: This parameter acquisition board is used for a certain type of synchronous orbit communication satellite, located in ...

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Abstract

A method for determining a spacecraft electronic assembly heat cycle test scheme comprises the first step of determining a heat cycle test alternative scheme, the second step of calculating the temperature difference delta T1 of all components of a spacecraft electronic assembly under the heat cycle test condition, the third step of analyzing the heat cycle test validity of the spacecraft electronic assembly, the fourth step of calculating the temperature difference delta T2 of all the components of the spacecraft electronic assembly under the normal work condition, the fifth step of analyzing heat cycle test damage of the spacecraft electronic assembly, the sixth step of analyzing normal work damage of the spacecraft electronic assembly, the seventh step of analyzing heat cycle test acceptability of the spacecraft electronic assembly and the eighth step of finally determining the heat cycle test scheme. According to the method, the heat cycle test scheme can be prevented from causing over-tests and under-tests on the spacecraft electronic assembly, and the application risk of the spacecraft electronic assembly in the astronavigation project is lowered.

Description

(1) Technical field: [0001] The invention relates to a method for determining a thermal cycle test scheme of an electronic component of a spacecraft, which is suitable for evaluating whether various thermal cycle test schemes adopted by different electronic components of a spacecraft are reasonable and effective, and is dedicated to avoiding the impact of the thermal cycle test scheme on the electronic component of a spacecraft. The method of causing over-test and under-test and reducing the application risk of spacecraft electronic components in aerospace engineering belongs to the technical field of spacecraft thermal cycle test. (two) background technology: [0002] In the development process of spacecraft electronic product components, reasonable and effective thermal cycle tests can screen out potential early failures of spacecraft electronic components and ensure the reliability and service life of spacecraft electronic components. [0003] In current engineering pract...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00
Inventor 付桂翠苏昱太谷瀚天万博
Owner BEIHANG UNIV
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