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Surface Mount Device-type Low-profile Oscillator

A surface-mounted, oscillator technology, applied in power oscillators, electrical components, impedance networks, etc., can solve the problems of reduced container rigidity and larger installation area.

Inactive Publication Date: 2014-08-06
NIHON DEMPA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this technique, there is a possibility that the rigidity of the container may be lowered due to via holes.
[0009] In addition, when bonding an IC chip or an IC bare chip integrated with an oscillating circuit to a vibrator unit including a crystal, etc., providing connection electrodes on their side walls can achieve low profile, but the mounting area ( The coverage area (footprint) also becomes larger

Method used

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  • Surface Mount Device-type Low-profile Oscillator
  • Surface Mount Device-type Low-profile Oscillator
  • Surface Mount Device-type Low-profile Oscillator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] Fig. 1(A) and Fig. 1(B) are diagrams illustrating Embodiment 1 of the surface mount type low-profile oscillator of the present invention, and Fig. 1(A) is a diagram showing the state before bonding the vibrator unit and the IC chip unit , FIG. 1(B) is a diagram showing the state after joining. In Embodiment 1, a reverse mesa crystal resonator in which both the container body and the resonator are composed of a resonator forming plate (also referred to simply as a crystal plate) is used as the resonator unit 2 . Also, the IC chip unit 3 is an IC bare chip. 2(A) and 2(B) are explanatory diagrams of a vibrator unit including the crystal resonator in FIG. 1(A) and FIG. 1(B), that is, an inverted mesa type resonator. Fig. 3 (A), Fig. 3 (B), Fig. 3 (C) are explanatory diagrams of the IC chip unit in Fig. 1 (A), Fig. 1 (B), Fig. 3 (A) is the vibrator of IC chip unit 3 3 (B) is a cross-sectional view along line A-A' of FIG. 3 (A), and FIG. 3 (C) is a plan view of the mounting...

Embodiment 2

[0101] 4(A), FIG. 4(B), and FIG. 4(C) are explanatory views of a vibrator unit constituting Example 2 of the surface-mounted low-profile oscillator of the present invention. Fig. 4(A) shows the longitudinal sectional view of the vibrator unit, Fig. 4(B) shows the side view of the low-profile oscillator shown in Fig. 4(A) from the direction of arrow A, and Fig. 4(C) shows A plan view of the base plate showing the external terminal arrangement. This embodiment is the same as the first embodiment in that the vibrator unit and the IC chip unit are stacked up and down, but the position of the external terminal 21 of the vibrator unit 2 constituting the oscillator is different from the first embodiment. The basic structure of the vibrator unit 2 is the same as that of the first embodiment described in FIG. 2(A) and FIG. layers. The vibrator 20 is also formed by forming thin-film excitation electrodes 20a, 20b by vapor deposition or sputtering on the front and back surfaces of the ...

Embodiment 3

[0103] 5(A), FIG. 5(B), and FIG. 5(C) are diagrams illustrating an IC chip unit of Embodiment 3 of the surface mount type low-profile oscillator of the present invention. The IC chip unit 3 is as shown in FIG. 5(A), and an integrated circuit portion (IC circuit pattern) 30, a crystal connection terminal 31 connected to an external terminal of the vibrator unit, and an IC electrode are formed on the main surface of the silicon plate of the bare chip. Terminal 32. The crystal connection terminals 31 are arranged corresponding to the positions of the external terminals of the vibrator unit. The crystal connection terminals 31 and the IC electrode terminals 32 are formed on the main surface in the shape of thin electrodes (see FIG. 5(B)). Fig. 4 (A), Fig. 4 (B), the external terminal 21 of vibrator unit 2 shown in Fig. 4 (C) and the crystal connection terminal 31 of IC chip unit 3 are the same as Fig. 1 (B), utilize each direction The solder particles of the heterosexual conduct...

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Abstract

A surface mount device-type low-profile oscillator is provided. A main surface of an IC chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed. An integrated circuit portion includes a circuit forming, together with the crystal unit of the crystal unit section, an oscillator circuit on the main surface of the IC chip unit, and IC terminals formed with a plurality of IC electrode terminals, and two connection terminals connecting the external terminals of the crystal unit section are provided. The IC electrode terminals and mounting terminals are electrically connected with electrical columns provided in via holes penetrating in the direction of thickness of a silicon plate of a bare chip. The crystal unit section and the IC chip unit are joined with an anisotropic conductive adhesive applied to the main surface of the IC chip unit.

Description

technical field [0001] The present invention relates to an oscillator, and in particular to an IC (Integrated Circuit, integrated circuit) chip unit (chip unit) that forms an oscillation circuit together with the vibrator unit, thereby reducing the profile (low profile) and Miniaturized surface mount low profile oscillators. Background technique [0002] Since surface-mounted oscillators are small and lightweight, they are incorporated as reference standards for frequency and time in portable electronic devices typified by high-performance mobile phones (so-called smart phones), for example. Such an oscillator includes a vibrator unit and an IC chip that house a vibrator or a resonator (hereinafter referred to as a vibrator). An oscillation circuit section, a buffer circuit section, and the like constituting an oscillation circuit together with a vibrator are integrated in the IC chip. Furthermore, depending on the type of the oscillator, circuits or mechanisms required to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/10H03H9/05
CPCH03B5/32H03H9/0538
Inventor 浅村文雄
Owner NIHON DEMPA KOGYO CO LTD
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