Image sensor module and forming method thereof
An image sensor and image sensing technology, which is applied in radiation control devices and other directions, can solve the problems of image sensor module performance that needs to be improved, and achieve the effects of superior structural performance, high flexibility, and reduced design cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0047] It can be seen from the background art that the existing chip packaging including the image sensing unit and the signal processing unit is difficult, and the performance of the formed image sensor module needs to be improved.
[0048] It is found through research that in the prior art, the image sensing unit and the signal processing unit are usually packaged on the same chip. To form a signal processing chip on an image sensor chip, it is a difficult technology to consider the arrangement and interconnection between the two, which will lead to an increase in the difficulty of the packaging process; at the same time, the cost of the image sensor chip is high , after the signal processing chip is arranged on the image sensing chip, in order to consider the interconnection between the signal processing chip, the area of the image sensing chip will inevitably be increased, resulting in a significant increase in the packaging process cost; and, due to the signal processing...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com