Grid strain analysis method for thin plate forming and application of method

Abstract

The invention discloses a grid strain analysis method for thin plate forming and an application of the method, and relates to forming production techniques of metal materials such as automobiles and small metal components. The method comprises the following steps: firstly, directly drawing grid lines with the same length in a centralized limited strain area for forming metal plate workpieces and on the surface of metal plates, after stamping deforming, measuring direct deformation values of the grid lines with wrinkles or cracks in the centralized limited strain area, and respectively adjusting the process according to the calculated deformation situations. The method can be applied to stamping sites at any time, and is generally not limited by conditions. The method can be widely popularized and used in production lines, and is low in cost and easy to master.

Description

technical field [0001] The invention relates to the forming production technology of metal materials such as automobiles and small hardware, especially the processing technology field of complex shapes made of thin plates to solve the problems of wrinkling, cracking and springback of formed parts on the stamping production site. Background technique [0002] In stamping production, when the strain value is greater than the elongation of the sheet, the sheet will crack; when the strain value is negative to a certain value or the strain value of adjacent parts changes greatly in the unconstrained state, the sheet will wrinkle and spring back . [0003] In order to obtain the material strain of the corresponding parts before and after the workpiece is formed, the laboratory of the scientific research institute adopts a measurement method called "grid strain analysis method". The method is to make a coordinate circular grid on the part of the preformed sheet that may wrinkle or...

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Problems solved by technology

[0004] Since this method is obtained by electrochemical etching or photolithographic chemical etching of the circular grid lines on the plate, although the precision is high, the cost is high, the operation process is complicated, and the cost is high. It is difficult for ordinary people to fully grasp it. , so the grid strain analysis method used to be limited to the research on the formability of thin plate materials by scientific research institutes or large-scale enterprise research institutes (rooms), and could not be extended to the actual production line.

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