Reflection type monitoring device for laser micro processing process

Abstract

The invention discloses a reflection type monitoring device for a laser micro processing process. The reflection type monitoring device comprises a helium-neon laser. A workpiece is arranged on an emission line of a detection laser beam emitted from the front end of the helium-neon laser, a first photoelectric probe is arranged on a reflection line of the detection laser beam of the workpiece, a laser splitting piece is arranged in the middle of the emission line of the detection laser beam at the front end of the helium-neon laser and specifically divides the detection laser beam into a reference signal and a reflected light signal, the reflected light signal enters the first photoelectric probe after being reflected by the workpiece, a second photoelectric probe is arranged at the front end of a reference light signal which directly enters the second photoelectric probe, a first data line is fixedly arranged on the first photoelectric probe, a second data line is fixedly arranged on the second photoelectric probe, and an oscilloscope is arranged between the first data line and the second data line. According to the technical scheme, the reflection type monitoring device is simple in structure, high in applicability, low in cost, small in collected data size and high in collection speed.

Description

technical field [0001] The invention relates to the technical field of laser micromachining, in particular to a reflective monitoring device for the laser micromachining process. Background technique [0002] At present, CCD cameras are commonly used in the process of laser micromachining for on-site shooting and monitoring. In the high-precision micromachining process, it is even necessary to operate under a microscope to ensure the processing quality. This kind of monitoring system is too complicated and the monitoring cost is too expensive, especially the data collected by monitoring is two-dimensional image data or even video data stream, resulting in too large amount of data. In addition, during the processing, the changes in the key micro-nano structure of the material cannot be significantly prompted. Contents of the invention [0003] In view of the deficiencies in the prior art, the object of the present invention is to provide a reflective monitoring device for...

AI Technical Summary

Problems solved by technology

This type of monitoring system is too complex, and the monitoring cost is too expensive, especially the data collected by monitoring is two-dimensional image data or even video data stream, resulting in a large amount of data

In addition, during the processing, the change of the key micro-nano structure of the material cannot be significantly prompted

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