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Electronic Part Installing Device And Electronic Part Installing Method

A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve the problems of time-consuming image analysis, reduction of substrate production quantity, etc., and achieve the effect of suppressing the reduction of production quantity

Active Publication Date: 2014-07-09
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since image analysis takes time, the number of substrates produced per unit time may be reduced

Method used

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  • Electronic Part Installing Device And Electronic Part Installing Method
  • Electronic Part Installing Device And Electronic Part Installing Method
  • Electronic Part Installing Device And Electronic Part Installing Method

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Embodiment Construction

[0034] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0035] Hereinafter, embodiments of the electronic component mounting apparatus according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting device of the present invention is an electronic component mounting device for mounting a so-called plug-in type electronic component having a l...

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PUM

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Abstract

The present invention provides an electronic part installing device and an electronic part installing method, which restrain the reduction in the production number of substrates at per unit time. The electronic part installing device comprises a substrate conveying part for conveying the substrates on which marks are formed, wherein the marks are references of the installation positions of the electroinc parts; a shooting part for shooting the substrates conveyed by the substrate conveying part; a storage part for storing the design positions marked on the substrates; and a control part for correcting the positions of the electronic parts arranged on the substrates based on the deviation between the positions of the marks in the images shot by the shooting part and the design positions. The control part corrects the positions of the electronic parts which are arranged on the substrates, based on a second representative value obtained by shooting the substrates of a specified number on the condition that a first representative value or offset of the deviation obtained by shooting the substrates of the specified number is less than a threshold value.

Description

technical field [0001] The present invention relates to an electronic component mounting device and an electronic component mounting method for mounting electronic components on a substrate. Background technique [0002] When mounting an electronic component with a lead on a substrate, the electronic component mounting apparatus inserts the lead of the electronic component into a through hole formed on the substrate to mount it. The electronic component mounting apparatus executes a process for detecting a position of a substrate where a through hole is formed when mounting an electronic component. Patent Document 1 describes a method in which an image of a through hole is captured, the position of the through hole on the substrate is detected by analyzing the captured image, and the detected position is set as The origin of the substrate. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 7-91914 [0004] The device described in Patent Document 1 can d...

Claims

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Application Information

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IPC IPC(8): H05K13/04H05K13/08
Inventor 齐藤乐
Owner JUKI CORP
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