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Alkaline imaging photosensitive resin composition and preparation method thereof

A photosensitive resin, photosensitive resin technology, applied in optomechanical equipment, photosensitive materials for optomechanical equipment, optics, etc., can solve the problems of inability to resolve lines, reduce exposure energy, and fail to promote industrialization.

Active Publication Date: 2014-07-02
WUXI DERBELL PHTO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, with the miniaturization, light weight, high performance, and high-density mounting of electrical equipment, the printed circuit board industry has continuously reduced the line width and line spacing of its lines, and the resolution of traditional line inks has been unable to reach the product. Requirements, increasing the exposure energy will cause poor vacuum suction, the circuit cannot be resolved, and reducing the exposure energy will cause a series of problems such as open circuit gaps
Many PCB manufacturers use expensive dry film instead of traditional line ink to meet product requirements in products with high precision requirements; however, increasing the use of photosensitive monomers and photoinitiators in traditional line ink can improve its Analytical ability, but its dryness to touch (non-sticky hand) is significantly worse, and it cannot be promoted in industrialization

Method used

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Examples

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Effect test

example 1

[0096] (1), add 360g o-cresol novolak epoxy resin, 125g acrylic acid, 2.5g as triphenylphosphine, 450g propylene glycol methyl ether acetate in the 2L detachable flask that possesses thermometer, reflux condenser, stirrer As a solvent, heat up to 115°C for 12 hours, then cool to 60°C, add 250g of phthalic anhydride and 0.8g of p-methoxyphenol as a polymerization inhibitor, heat up to 100°C for 8 hours, then cool down to Add 100 g of glycidyl methacrylate and 0.6 g of hydroquinone as a polymerization inhibitor after 60 ° C, and control the temperature at 95 ° C for 8 hours to obtain a quick-drying carboxyl-containing photosensitive resin of the present invention; The fast-drying carboxyl group-containing photosensitive resin has a solid content of 65wt%, an acid value of 55-65 mgKOH / g, and an average molecular weight of 10,000;

[0097] (2) Add 90g of acrylic acid, 480g of propylene glycol methyl ether acetate into a 2L detachable flask equipped with a thermometer, a reflux con...

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PUM

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Abstract

The invention relates to an alkaline imaging photosensitive resin composition which is characterized by comprising the following components in parts by weight: (1) 20-35 parts of quick-drying type carboxyl-containing photosensitive resin; (2) 5-25 parts of quick-drying type acrylate polymer; (3) 5-15 parts of composition of which the molecules contain more than two olefinic unsaturated groups; (4) 3-10 parts of photoinitiator composition; and (5) 35-50 parts of filler. The invention also relates to a method for preparing the alkaline imaging photosensitive resin composition. The alkaline imaging photosensitive resin composition has the advantages that the formed coating is high in dry-to-touch property (tack-free property), and excellent light sensitivity and resolution can be obtained under low energy, so that the requirements of high-precision circuit etching can be met.

Description

technical field [0001] The invention relates to a photosensitive resin composition, in particular to an alkaline developing type photosensitive resin composition and a preparation method thereof. Background technique [0002] Traditionally, in the manufacture and production of printed circuit boards (PCB), line inks are used for the purpose of line formation. The so-called circuit ink refers to covering the copper surface of the substrate, using exposure and alkaline development to carry out image transfer, and forming a coating film with a specific pattern, so as to achieve anti-etching and form a protective material for a specific circuit. [0003] In recent years, with the miniaturization, light weight, high performance, and high-density mounting of electrical equipment, the printed circuit board industry has continuously reduced the line width and line spacing of its lines, and the resolution of traditional line inks has been unable to reach the product. Requirements, i...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004G03F7/00
Inventor 朱贤红
Owner WUXI DERBELL PHTO ELECTRONICS MATERIAL
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