Quick-drying-type carboxyl-containing photosensitive resin and preparation method thereof

A photosensitive resin, quick-drying technology, applied in photomechanical equipment, patterned surface photoengraving process, photosensitive materials used in optomechanical equipment, etc. , Unable to carry out industrialization promotion and other problems, to achieve the effect of excellent sensitivity and resolution, excellent non-stick chirality, and meet the requirements of high-precision circuit etching

Inactive Publication Date: 2014-07-02
WUXI DERBELL PHTO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, with the miniaturization, light weight, high performance, and high-density mounting of electrical equipment, the printed circuit board industry has continuously reduced the line width and line spacing of its lines, and the resolution of traditional line inks has been unable to reach the product. Requirements, increasing the exposure energy will cause poor vacuum suction, the circuit cannot be resolved, and reducing the exposure energy will cause a series of problems such as open circuit gaps
Many PCB manufacturers use expensive dry film instead of traditional line ink to meet product requirements in products with high precision requirements; however, increasing the use of photosensitive monomers and photoinitiators in traditional line ink can improve its Analytical ability, but its dryness to touch (non-sticky hand) is significantly worse, and it cannot be promoted in industrialization

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0068] (1), add 360g o-cresol novolak epoxy resin, 125g acrylic acid, 2.5g as triphenylphosphine, 450g propylene glycol methyl ether acetate in the 2L detachable flask that possesses thermometer, reflux condenser, stirrer As a solvent, heat up to 115°C for 12 hours, then cool to 60°C, add 250g of phthalic anhydride and 0.8g of p-methoxyphenol as a polymerization inhibitor, heat up to 100°C for 8 hours, then cool down to Add 100 g of glycidyl methacrylate and 0.6 g of hydroquinone as a polymerization inhibitor after 60 ° C, and control the temperature at 95 ° C for 8 hours to obtain a quick-drying carboxyl-containing photosensitive resin of the present invention; The fast-drying carboxyl group-containing photosensitive resin has a solid content of 65wt%, an acid value of 55-65 mgKOH / g, and an average molecular weight of 10,000;

[0069] (2) Add 90g of acrylic acid, 480g of propylene glycol methyl ether acetate into a 2L detachable flask equipped with a thermometer, a reflux con...

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Abstract

The invention relates to a quick-drying-type carboxyl-containing photosensitive resin which is characterized in that an acid value of the photosensitive resin is 40-150KOH / g, the solid content is 40-70 weight percent, and the average molecular weight is 8000-15000. The invention also relates to a method for preparing the quick-drying-type carboxyl-containing photosensitive resin. The invention has the advantages that a coating formed by an alkaline imaging photosensitive resin compound of the quick-drying type carboxyl-containing photosensitive resin is high in finger touch dryness (tack-free property), and excellent photosensitivity and resolution can be obtained under low energy, so that the requirement on high-precision circuit etching can be met.

Description

technical field [0001] The invention relates to a carboxyl-containing photosensitive resin, in particular to a fast-drying carboxyl-containing photosensitive resin and a preparation method thereof. Background technique [0002] Traditionally, in the manufacture and production of printed circuit boards (PCB), line inks are used for the purpose of line formation. The so-called circuit ink refers to covering the copper surface of the substrate, using exposure and alkaline development to carry out image transfer, and forming a coating film with a specific pattern, so as to achieve anti-etching and form a protective material for a specific circuit. [0003] In recent years, with the miniaturization, light weight, high performance, and high-density mounting of electrical equipment, the printed circuit board industry has continuously reduced the line width and line spacing of its lines, and the resolution of traditional line inks has been unable to reach the product. Requirements,...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027
Inventor 朱贤红
Owner WUXI DERBELL PHTO ELECTRONICS MATERIAL
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