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Epitaxial growth method for improving luminous efficiency of LED

A technology of epitaxial growth and luminous efficiency, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as the influence of luminous efficiency, unfavorable material growth, etc., to reduce the electron spillover effect, improve the growth quality, and reduce the injected kinetic energy Effect

Inactive Publication Date: 2014-06-25
西安利科光电科技有限公司
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Problems solved by technology

According to our analysis, the p-type AlGaN layer in the prior art is a single layer, and to play a good role in blocking electrons, the height of the potential barrier needs to be increased, but a higher potential barrier will also limit the injection efficiency of holes. At the same time, it is not conducive to the growth of materials, and the thickness of AlGaN must be controlled during the growth process. Too thick or too thin will have adverse effects, which will greatly affect the luminous efficiency of LEDs.

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[0040] 1. After cleaning the sapphire substrate, put it into the MOCVD equipment and bake it at 1100°C for 10 minutes.

[0041] 2. Lower the temperature to 550°C to grow a low-temperature GaN layer with a thickness of 20nm, and the growth pressure is 400torr.

[0042] 3. Raise the temperature to 1020°C to grow a layer of undoped GaN layer with a thickness of 1um at high temperature, and the growth pressure is 300torr.

[0043] 4. A layer of 0.5um n-type GaN layer doped with SiH4 is grown at a temperature of 1030°C and a pressure of 200torr.

[0044] 5. Grow a 20nm silane-doped n-type AlGaN layer at a temperature of 1030°C and a pressure of 200torr.

[0045] 6. In a nitrogen atmosphere, grow a layer of 12nm GaN at 850°C and a layer of 3nm InGaN quantum well barrier structure at 750°C at 400torr, and grow for 3 cycles.

[0046] 7. Then the temperature rises to 950°C, turns on SiH4, and grows a layer of AlGaN. During the growth, the molar flow rate of Al gradually increases fro...

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Abstract

The invention provides an epitaxial growth method for improving luminous efficiency of an LED. According to the method, a layer of doped n-type AlGaN barrier layer is added in a growth GaN / InGaN quantum well barrier periodic structure, an Al component gradient structure is adopted, electrons in an n area can be blocked partially, the injection kinetic energy of the electrons can be reduced, hot electrons can be captured by a potential well easily and can easily generate recombination luminescence with electron holes in a later quantum well area, and the electron overflow effect is reduced. The Al component gradient structure is adopted by a later p-type AlGaN barrier layer, growth quality of materials can be improved, and compared with a former single component structure, the gradient structure can facilitate the injection effect of the electron holes and play the function of secondary blocking.

Description

technical field [0001] The invention belongs to the technical field of LED device material preparation and structure design, and particularly relates to a new epitaxy method for growing GaN-based LEDs. Background technique [0002] The III-V semiconductor LED with GaN as the basic material has become the most promising lighting source at present. Compared with traditional lighting sources, LED semiconductor lighting sources have the advantages of high luminous efficiency, small size, long life, energy saving, environmental protection, etc. The current GaN-based LED epitaxial growth structure process is generally: first grow on a sapphire substrate A layer of low-temperature GaN buffer layer, and then grow a layer of undoped GaN at high temperature, and then grow a layer of n-type doped layer. The doping material is generally silane, which provides the electrons needed for LED compound light emission, and then grows Several cycles of GaN / InGaN quantum wells and quantum barri...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/30H01L33/00
CPCH01L33/007
Inventor 王晓波
Owner 西安利科光电科技有限公司
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