A single crystal silver bonding wire micro-pulling machine

Abstract

The invention discloses one A micro-drawing machine for single crystal silver bonding wires, comprising a forming box and a wire drawing box arranged side by side, a partition plate is provided between the forming box and the drawing box; Mounting plate; the mounting plate of the forming box body is provided with two tower wheels parallel to each other, a mold frame is arranged between the two tower wheels, a diamond mold group is installed in the mold frame, and a diamond mold group is installed on the top of each tower wheel. There is a spray pipe; a wire outlet hole is opened on the partition plate, and a diamond mold is arranged in the wire outlet hole; a wire inlet hole is opened on the side plate opposite to the partition board on the forming box; the wire drawing There is a cleaning mechanism in the box, and the cleaning mechanism is located at the wire outlet hole; the part of the installation plate of the drawing box located on the right side of the cleaning mechanism is provided with a sizing wheel, a double guide wheel and a wire take-up in turn from left to right. A tension guide wheel is arranged between the double guide wheels and the take-up reel. The single-crystal silver bonding wire micro-drawing machine of the present invention is specially used for drawing single-crystal silver bonding wires, and can pull relatively thick single-crystal silver bonding wires into micron-sized single-crystal silver bonding wires.

Description

technical field [0001] The invention relates to the field of wire drawing machines, in particular to a micro-drawing machine for single crystal silver bonding wires. Background technique [0002] The micro-drawing machine is a kind of wire-drawing machine, which is used to draw thicker bonding wires into micron-level bonding wires. Single crystal silver bonding wire is a new type of bonding wire. At present, there is no micro-pulling machine specially designed for it in the market. If the single crystal silver bonding wire is drawn with a common micro-drawing machine, the thickness of the single crystal silver bonding wire drawn out cannot reach the standard value, the product quality is not high, and the wire drawing speed is slow, and the production efficiency is low. Contents of the invention [0003] The object of the present invention is to overcome the deficiencies of the prior art, and provide a single gold-silver bonding wire micro-drawing machine specially used f...

AI Technical Summary

Problems solved by technology

If the single crystal silver bonding wire is drawn by an ordinary micro-drawing machine, the thickness of the single crystal silver bonding wire drawn out cannot reach the standard value, the product quality is not high, and the wire drawing speed is slow and the production efficiency is low.

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