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An Integrated Multichannel Energy Harvesting Micromechanical Structure

A technology of micro-mechanical structure and energy harvesting, applied in micro-structure technology, micro-structure device, micro-structure device composed of deformable elements, etc., to achieve the effect of high survival coefficient, low production cost, simple principle and structure

Active Publication Date: 2016-02-03
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, based on the idea of ​​system integration, there are few reports on the single-chip integration of multiple energy harvesting methods.

Method used

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  • An Integrated Multichannel Energy Harvesting Micromechanical Structure
  • An Integrated Multichannel Energy Harvesting Micromechanical Structure
  • An Integrated Multichannel Energy Harvesting Micromechanical Structure

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] Such as Figure 1 to Figure 5 Shown is an integrated multi-channel energy harvesting micromechanical structure, including a wafer substrate 4 and an energy harvesting unit 1; a lower electrode 3 is grown on the upper surface of the wafer substrate 4; the energy harvesting unit 1 It is a planar structure composed of multi-layer thin films, including a first insulating dielectric layer 14, an electret thin film layer 13, a second insulating dielectric layer 12 and a conductive electrode layer 11 from bottom to top. The energy collection unit 1 passes through the column 2 It is fixed above the wafer substrate 4 and forms a cantilever beam structure. In the natural state, the energy harvesting unit 1 is parallel to the position of the lower electrode 3; the conductive electrode layer 11 provides a low-loss carrier path for electromagnetic wave energy absorption, whi...

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Abstract

The invention discloses an integrated multi-channel energy harvesting micromechanical structure. The integrated multi-channel energy harvesting micromechanical structure comprises a wafer substrate and an energy harvesting unit. A lower electrode is grown on the upper surface of the wafer substrate. The energy harvesting unit is of a planar structure composed of a plurality of films and sequentially comprises a first insulating medium layer, an electret film layer, a second insulating medium layer and a conductive electrode layer from bottom to top, and the energy harvesting unit is fixed above the wafer substrate through stand columns to form a cantilever structure. The conductive electrode layer provides a low-loss carrier access for absorption of electromagnetic wave energy, and meanwhile the conductive electrode layer and the lower electrode form a capacitor structure. The structure is based on the integration idea, multiple energy harvesting modes are integrated on a single chip by means of micromechanical machining, and the structure can be suitable for various occasions and has the advantages of being high in survival coefficient and the like. The structure is simple in principle and structure, capable of being manufactured based on the traditional semiconductor machining technology, low in production cost and capable of being manufactured on a large area.

Description

technical field [0001] The invention relates to an integrated multi-channel energy harvesting micromechanical structure, in particular to an energy harvesting structure capable of simultaneously collecting two kinds of micro energy, electromagnetic energy and environmental vibration energy, which belongs to the energy harvesting technology. Background technique [0002] Energy Harvesting, also known as energy accumulation, uses ambient energy to provide power to small electronic and electrical devices. Energy harvesting modules capture milliwatts of energy from light, vibration, heat, radio waves, or biological sources; the power is then conditioned and stored in batteries, high-efficiency fast-charging capacitors, and more. When needed, the energy is released to provide battery life for external circuits. Typical application examples in this regard are: mobile phones, charging-free remote controls, clothes that generate electricity, E-tags (or smart packaging), passive clo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B3/00H02N1/08
Inventor 万能黄见秋尹奎波孙立涛
Owner SOUTHEAST UNIV
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