Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electrostatic atomization method for evenly distributing particles

A technology of electrostatic atomization and particle uniformity, applied in liquid spraying equipment, liquid supply devices, spray devices, etc., can solve the problems of low cost, short-circuit particle distribution, unevenness, etc., achieve low cost, speed up volatilization and evaporation, and high promotion Effects with Applied Value

Inactive Publication Date: 2014-04-30
SHANGHAI JIAO TONG UNIV
View PDF10 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can solve the problem that in the preparation of the existing ACF conductive film, the agglomeration of conductive particles in the conductive film is likely to cause a short circuit or the uneven particle distribution is likely to cause an open circuit. It has no effect on the conductive particles, and the cost is low. The distance between particles can be very small, which breaks through the distance limit of ACF, and has high promotion and application value

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrostatic atomization method for evenly distributing particles
  • Electrostatic atomization method for evenly distributing particles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] An electrostatic atomization method for uniform particle distribution, comprising the following steps:

[0045] 1. Select ethanol as the solvent, 0.03g of particles, 30g of solvent, the particles and the solvent are miscible to form a solution. Use an ultrasonic oscillator to perform ultrasonic vibration for 30 minutes to form a well-dispersed suspension.

[0046] 2. Set the flow rate of the micro-injection pump to 1ml / h, draw out the solution and push it to the needle.

[0047] 3. The outer diameter of the needle is 0.35mm, the inner diameter is 0.18mm, and the distance between poles is 20mm. The selected substrate is a silicon wafer with a diameter of 3.5 inches.

[0048] 4. Connect the positive pole of the voltage to the needle, and the substrate to ground. Adjust the voltage from 0 to 5.6kv slowly to form a stable atomization mode. Before forming a stable atomization mode, use the baffle to block the unstable droplets of different sizes formed in the previous mo...

Embodiment 2

[0052] An electrostatic atomization method for uniform particle distribution, comprising the following steps:

[0053] 1. Use isopropanol as the solvent, 0.05g of granules, 30g of solvent, and mix the granules and solvent to form a solution. Ultrasonic vibration for 30min forms a well-dispersed suspension.

[0054] 2. Set the flow rate of the micro-injection pump to 0.5ml / h, draw out the solution and push it to the needle.

[0055] 3. The outer diameter of the needle is 0.35mm, the inner diameter is 0.18mm, and the distance between poles is 20mm. The selected substrate is a silicon wafer with a diameter of 3.5 inches.

[0056] 4. Connect the positive pole of the voltage to the needle, and the substrate to ground. The regulation voltage slowly rises from 0 to 6.28kv to form a stable atomization mode. Before forming a stable atomization mode, use the baffle to block the unstable droplets of different sizes formed in the previous mode, and remove the baffle after the stable m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electrostatic atomization method for evenly distributing particles. The electrostatic atomization method includes the steps of a), preparing a mixed solution containing the particles; b), delivering the mixed solution prepared in the step a) through a pipeline to the position of a needle; c), subjecting the solution delivered to the position of the needle in the step b) to flow control to form liquid drops to output, applying voltage on the outputted liquid drops, and enabling the liquid drops to be crushed at the tip of liquid cone to form a plurality of little liquid drops flying towards a substrate and finally depositing on the substrate to obtain the substrate with particles evenly distributed, wherein the size of the voltage is set in a manner that the voltage value gradually increases from zero. The solution containing the particles is dispersed, and large-scale and even particle distribution with monolayer dispersion can be obtained on the receiving substrate; the electrostatic atomization method is low in cost, small in particle spacing and high in promotion and application value.

Description

technical field [0001] The invention relates to the field of packaging, in particular to an electrostatic atomization method for uniform particle distribution. Background technique [0002] With the development trend of light, thin and small consumer electronic products, the microelectronics packaging industry, especially the fine-pitch chip assembly and ultra-thin chip flip chip in the flexible electronics industry, have put forward higher requirements for packaging technology. The traditional packaging technology mainly includes BGA (Ball Grid Array) and FC (Flip Chip) technologies, which are limited by cost and positioning accuracy, and have been unable to meet the requirements of the semiconductor packaging industry for high-density packaging and small pitch. [0003] At present, Anisotropic Conductive Film (ACF) is the most widely used interconnection medium in the field of COG (Chip on Glass) packaging. It is composed of polymers and conductive particles uniformly disp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B05B5/16B05B15/00
CPCB05B5/08B05B5/16
Inventor 袁鑫熊振华盛鑫军贾磊巴政宇
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com