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housing for electronic devices

A technology for electronic devices and housings, which is applied to electrical equipment shells/cabinets/drawers, electrical components, etc., can solve problems such as product qualification rate and thermal shrinkage inconsistency that affect the visual effect of electronic device housings, and achieve improved appearance and improved appearance. The effect of pass rate

Active Publication Date: 2017-04-05
嘉善罗星创业投资有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the inconsistency of thermal shrinkage between plastic and metal, after bonding with heat-curing glue, the plastic shell and the metal shell will be misaligned during the heating and cooling process, and the fit gap will easily be generated by screw assembly, which will affect the The visual effect of the electronic device housing and the pass rate of the product

Method used

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  • housing for electronic devices
  • housing for electronic devices

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Embodiment Construction

[0017] see figure 1 and figure 2 , the housing 100 of the electronic device according to the embodiment of the present invention, which includes a first housing 10 having an opening 11, an elastic member 30 installed on the first housing 10, and an elastic member 30 installed on the first housing 10. The second housing 50 on the top, the pressing member 70 installed on the first housing 10 and located on the second housing, the fastener 80 fixing the first housing 10 and the pressing member 70, and passing through the pressing member The member 70 and abuts against the adjusting member 90 of the second housing 50 . In this embodiment, the first casing 10 is made of metal material, and the second casing 50 is made of plastic material.

[0018] Please refer to image 3 , the first housing 10 is provided with an opening 11 . The first housing 10 includes a bottom wall 12 , a side wall 13 bent and extended from the periphery of the bottom wall 12 , and a protrusion 14 formed ...

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Abstract

A shell of an electronic module comprises a first shell body with an opening, a second shell body assembled on the opening of the first shell body, and a fastening piece fixing the first shell body and the second shell body. The shell further comprises an elastic piece, a press-abutting piece and an adjusting piece. The elastic piece is arranged on the first shell body, and the second shell body abuts against the elastic piece, the press-abutting piece is pressed on the second shell body in an abutting mode and fixedly connected with the first shell body, and therefore the elastic piece and the second shell body are clamped between the first shell body and the press-abutting piece. The adjusting piece can penetrate through the press-abutting piece in an adjusting mode and abuts against the second shell body, so that the adjusting piece can move towards the second shell body in an adjusting mode, and the gap between the first shell body and the second shell body is adjusted.

Description

technical field [0001] The invention relates to a casing, in particular to a casing of an electronic device. Background technique [0002] Housings of electronic devices, such as mobile phone housings, tablet computer housings, etc., are usually formed by fixing different housings. For example, in order to improve the quality of signal reception, a casing made of plastic is usually used to cover the periphery of the antenna receiving the signal, so as to reduce the shielding of the antenna signal by the metal casing. The plastic shell and the metal shell are usually bonded with heat-curing glue or assembled directly by screws. However, due to the inconsistency of thermal shrinkage between plastic and metal, after bonding with heat-curing glue, the plastic shell and the metal shell will be misaligned during the heating and cooling process, and the fit gap will easily be generated by screw assembly, which will affect the The visual effect of the electronic device housing and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00
Inventor 尹美兰
Owner 嘉善罗星创业投资有限公司
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