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Junction temperature monitoring circuit system for high-power LED reliability test

A technology for monitoring circuit and reliability, which is applied to thermometers, thermometers, and measuring devices that use directly heat-sensitive electrical/magnetic components, and can solve problems such as the inability to monitor junction temperature changes in real time, to meet diversity and improve flexibility sexual effect

Inactive Publication Date: 2014-04-16
WUHAN TEXTILE UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing LED junction temperature testing device cannot monitor the junction temperature change in the LED reliability test in real time. The development of an online monitoring junction temperature technology is an important means to study the reliability of semiconductor lighting.

Method used

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  • Junction temperature monitoring circuit system for high-power LED reliability test
  • Junction temperature monitoring circuit system for high-power LED reliability test
  • Junction temperature monitoring circuit system for high-power LED reliability test

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with the accompanying drawings.

[0039] The specific structural principle block diagram of the monitoring circuit provided by the present invention is as figure 1 shown by figure 1 It can be seen that the monitoring circuit includes a fast switching module 100, a delay sampling module 200, a self-calibration module 300, a test constant current source module 400, and a driving constant current source module 500. The fast switching module will drive the constant current source module to cut off according to the sampling sequence. , the delay sampling module collects the forward voltage of the LED to be tested at the working time of the constant current source module, and the self-calibration module uses the inverse proportional amplification and zeroing circuit of the reference LED to obtain the voltage value corresponding to the current junction temperature, and the output The digital voltmeter conver...

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Abstract

The invention discloses a junction temperature monitoring circuit and method for a high-power LED reliability test. The circuit comprises a fast switching module, a delay sampling module, a self-calibration module, a constant current source testing module and a constant current source driving module, wherein the fast switching module is used for fast switching off the constant current source driving module, the delay sampling module is used for acquiring forward voltage drops at two ends of an LED and produced by the constant current source testing module, the self-calibration module is used for comparing forward voltages of the LED to be tested and a reference LED at different temperatures, eliminating physical property change of the LED to be tested due to testing current through a self-calibration link and obtaining the junction temperature of the LED to be tested in a reliability test environment. The circuit can monitor the stable junction temperature change tendency of the LED in work in real time, and a scientific evaluation basis is provided for description and evaluation of LED package module thermal performance in the reliability test.

Description

technical field [0001] The invention belongs to the field of photoelectric information detection and control, and in particular relates to a junction temperature monitoring circuit system for high-power LED reliability test. Background technique [0002] High-power LEDs are blue LED chips with a rated power above 1W, which are packaged to form the basic components of semiconductor lighting. At present, the reliability of high-power LEDs is the bottleneck restricting its development in the field of semiconductor lighting. Junction temperature, which is closely related to light decay and life, has become a prominent problem. As an important parameter for evaluating reliability, LED luminous flux is not only chip size and chip size. A function of the process, or a function of the junction temperature. In the prior art, there is no technology and method for on-line monitoring of the fluctuation of high-power LED junction temperature in the reliability test. [0003] The existi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/00G01R31/26
Inventor 陈全许明耀刘胜
Owner WUHAN TEXTILE UNIV
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