Method for manufacturing circuit board
A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of poor bonding force of heat dissipation conductors 4, affecting the welding effect of heating components, and uncertainty of the height of prepreg 3, etc. The effect of sunken or convex problems
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[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0026] See figure 1 , Is a schematic flow chart of an embodiment of a method for manufacturing a circuit board provided by the present invention. The method specifically includes the following steps:
[0027] S1, providing a first substrate layer, a second substrate layer and a prepreg; the first substrate layer and the second substrate layer are bonded together by the prepreg;
[0028] S2, a first opening is opened on the second substrate ...
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