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Plate grid surface dip bonding liquid and polar plate curing process method

A technology of electrode plate curing and process method, which is applied in the direction of lead-acid battery electrodes, etc., can solve the problems of affecting the consistency of electrode plate curing, insufficient strength of lead paste, and worsening consistency of electrode plate curing.

Active Publication Date: 2014-04-09
HENAN CHAOWEI POWER SUPPLY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Due to the rapid decay of battery lead capacity for 50 cycles, this phenomenon is caused by the poor bonding between the grid surface and the lead paste, which increases the interface resistance. This resistance will become larger and larger as the charge and discharge progress. Many battery manufacturers In order to solve this problem, the method of prolonging the curing time of the plates is solved. In fact, the extended time of curing due to the oxidation and heat generation of the lead paste in the later stage will cause some plates to be dry and some plates to be wet, which will affect the consistency of the plates’ curing, thus Did not improve product quality
Some manufacturers also add adhesives to the lead paste formula. Because of the viscosity, the pores between the lead paste and the lead paste are also blocked, which will easily lead to a decrease in the porosity of the lead paste and thus reduce the battery capacity; The lead paste is oxidized and adhered to the surface of the grid. Although the surface of the grid is oxidized, it is indeed adhered to the lead paste, but a large amount of lead paste is also oxidized and becomes loose. The subsequent charging lead paste is not strong enough and easy to fall off. Conversely results in shorter battery life
Based on the above, prolonging the curing time can improve part of the bonding force between the grid and the lead paste, but the consistency of the plate curing becomes poor, which cannot meet the consistency requirements of the battery. Although the formula is added to the lead paste, although the surface of the grid and the lead paste are well bonded, However, the porosity of the lead paste decreases or the problem of loosening and falling off occurs again, so curing and paste formulation are not effective in improving the interface resistance between the grid and the lead paste

Method used

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  • Plate grid surface dip bonding liquid and polar plate curing process method

Examples

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Effect test

Embodiment 1

[0012] Example 1: The method of dipping the grid into the bonding solution is used for improvement. The steps are: heat the pure water to 45°C, then add sodium perborate and antimony trioxide to dissolve, and obtain a solution (hereinafter referred to as liquid state), every 100 Kg of pure water, add 8 kg of sodium perborate, add 3 kg of antimony trioxide, keep the temperature of the solution at 45°C, immerse the grid for 2 seconds, then dry naturally for 20 minutes, the conductivity of the pure water is ≤2μs / cm;

[0013] Plate curing process: apply wet lead paste on the above-mentioned dry grid according to the conventional method, and then transport the plate coated with wet edge paste to a humidified and heated curing room for curing. Moisturizing stage: the temperature is 45°C , the humidity is 97%, the moisture of the lead paste is 8%, and the time is 15 hours; the oxidation stage of the lead paste: the moisture of the lead paste is controlled at 2%, the temperature is c...

Embodiment 2

[0015] Use the method of dipping the grid into the bonding solution to improve. The steps are: heat the pure water to 50°C, then add sodium perborate and antimony trioxide to dissolve, and obtain a solution (hereinafter referred to as liquid state), per 100 kg of pure water, Add 11 kg of sodium perborate, add 4 kg of antimony trioxide, keep the solution temperature at 50 ° C, immerse the grid for 3 seconds, and then dry it naturally for 30 minutes, the conductivity of the pure water is ≤ 2 μs / cm;

[0016] Plate curing process: apply wet lead paste on the above-mentioned dry grid according to the conventional method, and then transport the plate coated with wet edge paste to a humidified and heated curing room for curing. Moisturizing stage: the temperature is 50°C , the humidity is 98%, the moisture of the lead paste is 9%, and the time is 19 hours; the oxidation stage of the lead paste: the moisture of the lead paste is controlled at 3%, the temperature is controlled at 62°C, ...

Embodiment 3

[0018] The method of dipping the grid into the bonding solution is used for improvement. The steps are: heat the pure water to 55°C, then add sodium perborate and antimony trioxide to dissolve to obtain a solution (hereinafter referred to as liquid state), per 100 kg of pure water, Add 15 kg of sodium perborate, add 5 kg of antimony trioxide, keep the temperature of the solution at 55°C, immerse the grid for 5 seconds, and then dry it naturally for 40 minutes. The conductivity of the pure water is ≤2 μs / cm;

[0019] Plate curing process: apply wet lead paste on the above-mentioned dry grid according to the conventional method, and then transport the plate coated with wet edge paste to a humidified and heated curing room for curing. Moisturizing stage: the temperature is 55°C , the humidity is 100%, the moisture of the lead paste is 11%, and the time is 24 hours; the oxidation stage of the lead paste: the moisture of the lead paste is controlled at 5%, the temperature is control...

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Abstract

The invention relates to a plate grid surface dip bonding liquid and a polar plate curing process method. A preparation method of the plate grid dip bonding liquid comprises the steps: heating pure water to 45-55 DEG C, then adding sodium perborate and antimony trioxide to dissolve, thus obtaining a solution, adding 8-15 kg of sodium perborate and adding 3-5 kg of antimony trioxide for each 100 kg of pure water, keeping the solution temperature at 45-55 DEG C, dipping a plate grid for 1-5 seconds, and then naturally drying for 20-40 minutes. The pure water conductivity rate is less than or equal to 2 [mu]s / cm. The invention aims to provide the plate grid surface dip bonding liquid and the polar plate curing process method, and is used for solving the problems of an interfacial resistance between the plate grid and a lead paste.

Description

technical field [0001] The invention relates to a process method for dipping mucus on the surface of a grid and solidifying a polar plate. Background technique [0002] Due to the rapid decay of battery lead capacity for 50 cycles, this phenomenon is caused by the poor bonding between the grid surface and the lead paste, which increases the interface resistance. This resistance will become larger and larger as the charge and discharge progress. Many battery manufacturers In order to solve this problem, the method of prolonging the curing time of the plates is solved. In fact, the extended time of curing due to the oxidation and heat generation of the lead paste in the later stage will cause some plates to be dry and some plates to be wet, which will affect the consistency of the plates’ curing, thus Product quality was not improved. Some manufacturers also add adhesives to the lead paste formula. Because of the viscosity, the pores between the lead paste and the lead paste ...

Claims

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Application Information

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IPC IPC(8): H01M4/20H01M4/21
CPCY02E60/126H01M4/20Y02E60/10
Inventor 李松林柴成雷
Owner HENAN CHAOWEI POWER SUPPLY
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