Mechanism capable of realizing lifting and rotating integrated movement of furnace door

Abstract

The invention discloses a mechanism capable of realizing a lifting and rotating integrated movement of a furnace door. One section of transmission thread is processed on each of the outer surface of a fixed threaded rod with limit and guide functions and the inner surface of an outer pipe of a movable threaded rod, the transmission threads are correspondingly matched, a drive device drives threads of outer pipes of the threaded rods through bearing assemblies to screw with thread grooves of the threaded rods and enables the outer pipes of the threaded rods to go up and down along the grooves of the threaded rods, the outer pipes of the threaded rods drive a furnace door to go up and down and rotate through a cantilever, and thus the furnace door is accurately controlled to open and close. According to the mechanism, through one drive source, by using the screwing function of the threaded rods and one section of transmission thread pair designed on the outer pipes of the threaded rods and using the limit and guide functions of the grooves of the threaded rods, the realization of the lifting and rotating integrated movement of the furnace door can be simply controlled, and thus the movement reliability is ensured, the movement time is shortened, the process efficiency is increased, and thereby the cost is saved.

Description

technical field [0001] The present invention relates to a motion control mechanism for a furnace door of a semiconductor vertical heat treatment equipment, and more particularly, to a control mechanism capable of realizing the integral movement of the furnace door of the semiconductor vertical heat treatment equipment in lifting and rotating. Background technique [0002] Semiconductor vertical heat treatment equipment may include, for example, vertical oxidation furnaces, LPCVD furnaces, vertical annealing furnaces, and the like. Before the semiconductor vertical heat treatment equipment starts the process, that is, before the quartz boat and silicon wafer are sent into the heating chamber, the furnace door needs to be opened; after the process is completed, that is, after the quartz boat and silicon wafer are moved out of the heating chamber, The furnace door needs to be closed to insulate the heat and so on. For its action process, please refer to figure 1 , figure 1 I...

AI Technical Summary

Problems solved by technology

This structure uses two linear cylinders, a set of linkages and guide rails for positioning directions, requiring at least two driving components, resulting in higher cost, larger volume and weight

[0006] The above existing technologies have the common defects of high cost, relatively large volume and weight, and relatively complex structure, which is very unfavorable to the semiconductor industry's strict cost control requirements, strict restrictions on equipment space and maintainability

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