Electronic component

A technology for electronic parts and components, applied in electrical components, components with fixed capacitors, capacitors, etc., can solve problems such as mechanical deformation, and achieve the effects of simple structure, suppression of joint obstacles, and easy installation structure

Active Publication Date: 2014-04-02
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, multilayer ceramic capacitors sometimes undergo mechanical deformation due to changes in the voltage applied to the multilayer ceramic capacitor

Method used

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Embodiment Construction

[0029] Electronic components according to embodiments of the present invention will be described with reference to the drawings. figure 1 (A) is an external perspective view of the electronic component 10 according to the embodiment, figure 1 (B) is a perspective view of the mounted state of the electronic component 10 . figure 2 It is a four-sided view of the electronic component 10 according to the embodiment, figure 2 (A) is a plan view, figure 2 (B) is the first (longitudinal surface side) side view, figure 2 (C) is a 2nd (short side surface side) side view, figure 2 (D) is a rear view. image 3 It is a 1st side view and a 2nd side view which show the mounted state of the electronic component 10 which concerns on embodiment.

[0030] The electronic component 10 includes a multilayer ceramic capacitor (chip component) 20 and an interposer 30 . Furthermore, in figure 2 In (A), the multilayer ceramic capacitor 20 mounted on the substrate 31 is omitted.

[0031] ...

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PUM

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Abstract

An electronic component (10) is provided with an interposer (30) and a laminated ceramic capacitor (20). The interposer (30) has a substrate (31) which is a rectangular parallelepiped having a parallel front surface and back surface. Two first mounting electrodes (311, 312) and two second mounting electrodes (313, 314) are formed at the lengthwise ends of the front surface of the substrate (31). Recesses (310) are formed in the long sides of the insulating substrate (31), and connection conductors (331, 332, 333, 334) are formed on the side walls of the recesses (310). The connection conductors (331, 332, 333, 334) connect a first external-connection electrode (321) and second external-connection electrode (322) formed on the back surface of the substrate (31) to the first mounting electrodes (311, 312) and the second mounting electrodes (313, 314).

Description

technical field [0001] The present invention relates to an electronic component including a multilayer ceramic capacitor and an interposer used when mounting the multilayer ceramic capacitor on a circuit board. Background technique [0002] Currently, chip components, especially small multilayer ceramic capacitors, are widely used in mobile terminal equipment such as mobile phones. A multilayer ceramic capacitor includes a rectangular component body functioning as a capacitor, and external electrodes formed at opposite ends of the component body. [0003] Conventionally, generally speaking, as shown in Patent Document 1, in a multilayer ceramic capacitor, the external electrodes are directly placed on the mounting pads of the circuit board of the mobile terminal, and the mounting pads and the external electrodes are bonded with a bonding agent such as solder. Bonding, so as to be electrically and physically connected to the circuit board. [0004] However, a multilayer cer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/06H05K1/18
CPCH05K2201/049H05K1/181H05K2201/09181H01G2/065H05K2201/10636H05K3/3442H01G4/228Y02P70/50
Inventor 服部和生藤本力
Owner MURATA MFG CO LTD
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