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Method and device for processing wafer sandwich blocks

A wafer and conveying device technology, applied in the direction of forming/molding baked waffles, etc., can solve the problems of limited conveying power, high acceleration force of wafers, and small mechanical resistance.

Active Publication Date: 2017-03-29
HAAS FOOD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The delay due to deceleration and restarting of the individual wafer slices corresponds to the limitation of the conveying power of the sandwich mold in the prior art
This is caused by the fact that crispy wafers cannot be accelerated and braked arbitrarily strongly, because wafers cannot withstand higher acceleration forces due to their small mechanical resistance

Method used

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  • Method and device for processing wafer sandwich blocks
  • Method and device for processing wafer sandwich blocks
  • Method and device for processing wafer sandwich blocks

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Embodiment Construction

[0016] figure 1 A device according to the invention for processing multi-layered wafer pieces filled with a spread, such as cream, is shown, with a first conveyor surface 4, which in the present embodiment comprises a first conveyor device 11 and a second conveyor device 12. Furthermore, a second conveying surface 6 is provided, which includes a third conveying device 13 and a fourth conveying device 14 . The second conveying surface comprises a raised section extending substantially parallel to the first conveying surface, an inclined section extending substantially from the raised section to the stacking location 5 and an entry point 18 which makes the second conveying surface substantially gradually The first conveying surface is approached linearly or wedge-shaped. Furthermore, a fifth conveying device 15 is provided. It includes positioning elements 10 which are arranged substantially in motion along the second conveying plane. Furthermore, a detector 16 is provided i...

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Abstract

A device and a method produce multi-layered wafer blocks filled with a spreadable mixture such as a cream. A wafer base sheet coated with a spreadable mixture is transported along a first conveyor surface to a stacking area. A wafer cover sheet is transported along a second conveyor surface to the same stacking area. The wafer cover sheet is laid flat on the coated side of the wafer base sheet in the stacking area, and then the wafer base sheet and the wafer cover sheet are transported away together. The wafer cover sheet and wafer base sheet are moved respectively in the stacking area at a speed that is different from zero at all moments.

Description

technical field [0001] The invention relates to a device and a method for processing multi-layered wafer pieces filled with a spread, such as cream, in which the spread-coated wafer base is transported along a first transport plane to a stacking zone , the wafer top sheet is transported to the same stacking area along the second conveying surface. Wafer bottom sheet and wafer top sheet. Background technique [0002] Such devices have long been known and are used in various embodiments. [0003] For example, devices and methods are known in which wafer slices, especially crispy flat wafers, are baked in an automatic tong machine, wherein the wafer slices are baked at high pressure in closed and closed wafer tongs Thoroughly, then cool. The wafer slices are preferably thin-walled, crispy wafers with dimensions up to 400x800 mm. Flat wafers are used, for example, to form cutouts which have a layered structure, for example alternating layers of wafer sheets and cream filling...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A21C15/02
CPCA21C15/02
Inventor J.哈亚斯K.哈德雷S.吉拉斯辰克J.雷斯纳L.希伊斯贝尔G.舒雷特纳
Owner HAAS FOOD EQUIP
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