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A heat pipe heat exchange type semiconductor refrigeration device

A refrigeration device and heat pipe heat exchange technology, applied in refrigerators, heating methods, indirect heat exchangers, etc., can solve problems such as high operating costs, refrigerant leakage environment, and waste of electric energy, and achieve long-distance transmission. heat, save cost, and ensure the effect of work stability

Active Publication Date: 2018-08-10
BEIJING FULLLINK OREITH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the air-conditioning system used to control the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, resulting in unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollution to the environment

Method used

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  • A heat pipe heat exchange type semiconductor refrigeration device
  • A heat pipe heat exchange type semiconductor refrigeration device

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Embodiment Construction

[0015] Such as figure 1 The schematic diagram of the structure of the heat pipe heat exchange type semiconductor refrigeration device shown in the present invention includes a semiconductor refrigeration sheet (1), an outer heat pipe evaporator (2), an outer heat pipe condenser (5), an inner heat pipe condenser (3), an inner heat pipe condenser (3), and The heat pipe condenser (4), the blower fan (6) of the inner heat pipe evaporator, the fan (7) of the outer heat pipe condenser, the air guide pipe, the liquid guide pipe and the control circuit; the fan (7) of the outer heat pipe condenser is installed outside On the heat pipe condenser (5), the outer heat pipe evaporator (2) is in close contact with the heating surface of the semiconductor refrigeration sheet (1); the fan (6) of the inner heat pipe evaporator is installed on the inner heat pipe evaporator (4) , the inner heat pipe condenser (3) is in close contact with the cooling surface of the semiconductor refrigeration sh...

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Abstract

The invention discloses a heat pipe heat-exchange-type semiconductor refrigeration device which is mainly composed of a semiconductor refrigerating sheet, an outer heat pipe evaporator, an outer heat pipe condenser, an inner heat pipe evaporator, an inner heat pipe condenser, a fan of the outer heat pipe condenser, a fan of the inner heat pipe evaporator, an air guiding pipe, a liquid guiding pipe and a control circuit. The fan of the outer heat pipe condenser is installed on the outer heat pipe condenser, the outer heat pipe evaporator is in close contact with the heating face of the semiconductor refrigerating sheet, the fan of the inner heat pipe evaporator is installed on the inner heat pipe evaporator, and the inner heat pipe condenser is in close contact with the heating face of the semiconductor refrigerating sheet. In this way, the radiating area of the semiconductor refrigerating face and the radiating area of the semiconductor heating face are increased through the gravity heat pipe heat conducting technology, the temperature of the indoor environment is indirectly changed, useless energy of the heating face of the semiconductor refrigerating sheet is transmitted out, compressed refrigerating fluid is replaced by the semiconductor refrigerating sheet to conduct refrigeration, and the heat pipe heat-exchange-type semiconductor refrigeration device is safe, reliable and free of environment pollution.

Description

technical field [0001] The invention belongs to the technical field of cold and heat energy transportation, and relates to a heat pipe heat exchange type semiconductor refrigeration device which combines a heat pipe heat exchange system and a semiconductor semiconductor refrigeration sheet to carry out cold and heat energy transportation. Background technique [0002] At present, the air-conditioning system used to regulate the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, which leads to unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollution to the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F24F5/00F24F13/30F25B21/02F28D15/02
Inventor 祝长宇丁式平
Owner BEIJING FULLLINK OREITH TECH CO LTD
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