Method for growing hole-tray seedlings with waste edible fungi

A technology for growing seedlings and edible fungi in plug trays, applied in application, cultivation, agriculture, etc., can solve problems such as environmental pollution and waste waste of edible fungi, and achieve the effect of avoiding pollution, avoiding waste, and consistent emergence height

Inactive Publication Date: 2014-03-26
殷俊林
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the above-mentioned deficiencies and provide a method for using edible fungus waste to grow seedlings in plug trays, so as to solve the problems of edible fungus waste and environmental pollution.

Method used

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  • Method for growing hole-tray seedlings with waste edible fungi

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Embodiment Construction

[0013] A kind of edible fungus waste of the present invention is used for the method technology of hole tray seedling raising comprising: (1) matrix production: 60% edible fungus waste, 10% cow dung, 5% straw, 5% chicken manure mix heap , turn over once every 7-10 days, until fully mature, then mix 20% fine slag and pile up for 15 days, (2) select black, inverted trapezoidal or inverted conical hole plate 1 with 32-288 holes, (3) After the tray 1 is sterilized, it is evenly filled into the substrate. (4) The holes are drilled for seeding, and the hole depths are consistent.

[0014] The utilization of edible fungi waste in the substrate not only saves the cost of substrate production, but also avoids the waste of edible fungus waste and environmental pollution. Adding waste to the substrate can ensure the nutritional needs of plants; inverted trapezoidal or inverted conical holes Tray 1 is conducive to the downward growth of the root system. The black tray 1 can absorb more so...

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Abstract

The invention relates to a method for recycling waste edible fungi, in particular to a method for growing hole-tray seedlings with waste edible fungi. The technology of the method includes the steps of substrate preparing, hole-tray selecting, filling and perforating sowing. The substrate preparing method includes the step that 60% of waste edible fungi, 10% of cow dung, 5% of straw and 5% of fowl manure are mixed and fermented in a pile, the mixture is turned every other 7-10 days, and after the mixture is ripe fully, 20% of thin-hollow slag is mixed into the mixture for being fermented for 15 days, hole trays are 32-288-hole hole trays in the shape of an inverted trapezoid or an inverted cone, the hole trays are evenly filled with the substrate after being disinfected, and perforating sowing is performed after the hole trays are filled with the substrate. The method has the advantages that the waste edible fungi are reasonably utilized, the environment is prevented from being polluted by the waste edible fungi, and waste of the waste edible fungi is avoided.

Description

technical field [0001] The invention relates to a method for reusing edible fungus waste, in particular to a method for using edible fungus waste to grow seedlings in plug trays. Background technique [0002] The waste after cultivating edible fungi, also known as fungus chaff, is rich in protein, polysaccharides and minerals. Usually, people treat it as garbage, or directly use a small amount of edible fungus waste as fertilizer for the growth and development of vegetables and fruits, but this will cause a great waste of edible fungus waste, and some people will produce edible fungi in order to avoid waste. After drying and crushing, the final waste is used as feed to replace part of the grain, and is fed to animals such as livestock, poultry, and fish, but it will cause pollution to the environment. Contents of the invention [0003] The purpose of the present invention is to overcome above-mentioned deficiency, provide a kind of method that edible mushroom waste is use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A01G9/10
Inventor 殷俊林
Owner 殷俊林
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