Subzero treatment process of copper material

Abstract

The invention discloses a subzero treatment process of a copper material. The subzero treatment process comprises the following steps: (1) dehumidifying, namely, dehumidifying and drying the to-be-treated copper material; (2) cooling, namely, putting the dried copper material into subzero equipment, and controlling the subzero equipment by using a computer so as to reduce the temperature linearly, wherein the reduction speed is 0.5-1 DEG C / minute, and the temperature is reduced to be minus 190 DEG C to minus 196 DEG C from normal temperature; (3) performing heat preservation, namely performing heat preservation for greater than or equal to 2 hours at minus 190 DEG C to minus 196 DEG C according to the size of the material; (4) raising the temperature, namely, linearly and slowly raising the temperature back to be the normal temperature in a balance circulation mode. Compared with the prior art, the subzero treatment process has the advantages that the problems that only the physical properties of a copper tissue are changed and the electric property influence is counteracted after subzero treatment are solved; according to the practical application situation, materials with different hardness and tension forces are treated by controlling the heat preservation time at minus 190 DEG C to minus 196 DEG. The copper material treated by the process can be applied to audios and liners, and the sound quality can be greatly improved.

Description

technical field [0001] The invention relates to a cryogenic treatment process for copper materials. Background technique [0002] The existing copper material (red copper) is made by heat treatment such as high temperature quenching (annealing). The scattering of electrons is correspondingly enhanced, which is not conducive to the transmission of electrons, thereby reducing the conductivity of the material. Although the crystal structure of the material treated by rapid cryogenic treatment has changed, the decrease of the vacancy concentration reduces the scattering effect of electrons, reduces the resistivity, and improves the conductivity, but it will also occur when using traditional cryogenic equipment for rapid cryogenic cooling. There are defects such as vacancies and dislocations at the grain boundaries of copper, which will cause a corresponding increase in the scattering of electrons, which is not conducive to the transmission of electrons, so the two aspects cance...

AI Technical Summary

Problems solved by technology

[0002] The existing copper material (red copper) is made by heat treatment such as high temperature quenching (annealing). The scattering of electrons is correspondingly enhanced, which is not conducive to the transmission of electrons, thereby reducing the conductivity of the material

Although the crystal structure of the material treated by rapid cryogenic treatment has changed, the decrease of the vacancy concentration reduces the scattering effect of electrons, reduces the resistivity, and improves the conductivity, but it will also occur when using traditional cryogenic equipment for rapid cryogenic cooling. There are defects such as vacancies and dislocations at the grain boundaries of copper, which will increase the scattering of electrons, which is not conducive to the transmission of electrons. Therefore, the two aspects cancel each other out, and there will be no improvement in electrical conductivity.