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Notebook cooler

A radiator and notebook technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of shortening the life of computer components, the influence of running speed, and the insignificant heat dissipation effect of the radiator.

Inactive Publication Date: 2014-02-19
KUNSHAN HAOKAI METAL PROD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of technology, the running speed of notebooks is getting faster and faster, and the display effect is getting better and better. The volume of notebooks is getting smaller and smaller, resulting in the integration of CPU (central processing unit) and GPU (graphics processing unit). The higher the temperature, the greater the heat dissipation. If the heat dissipation effect is not good, the computer components will work at high temperature. On the one hand, the running speed will be affected. On the other hand, the life of the computer components will be shortened, and even irreversible losses will be caused. , so the notebook computer needs a heat sink with good heat dissipation
[0003] The heat dissipation effect of the notebook radiator in the prior art is not obvious. Generally, the heat dissipation fan is used to correspond to the heat dissipation fan inside the notebook, which directly helps the internal heat dissipation fan to dissipate heat, but cannot dissipate heat to the notebook shell.

Method used

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  • Notebook cooler

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Embodiment Construction

[0011] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0012] see figure 1 , figure 1 It is a structural schematic diagram of the present invention.

[0013] Described a kind of notebook heat sink comprises heat dissipation mainboard 1, and described heat dissipation mainboard 1 is provided with two cooling fans 2 that are arranged side by side, and the both sides of described heat dissipation mainboard 1 is provided with heat dissipation side plate 3, and described heat dissipation side plate 3 is hinged on the heat dissipation main board 1 through a hinge 4, the heat dissipation side plate 3 on one side is provided with an air intake fan 5, and the...

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Abstract

The invention relates to a notebook cooler comprising a main cooling board which is provided with two parallelly-arranged cooling exhaust fans, two side cooling boards are arranged on two sides of the main cooling board and hinged to the main cooling board through hinges, and wind incoming fans are arranged on the side cooling board on one side while wind outgoing fans are arranged on the side cooling board on the other side. By the arrangement, cooling of an internal fan of a notebook can be assisted, and sides of the notebook can also be cooled.

Description

technical field [0001] The invention relates to a notebook radiator. Background technique [0002] With the development of technology, the running speed of notebooks is getting faster and faster, and the display effect is getting better and better. The volume of notebooks is getting smaller and smaller, resulting in the integration of CPU (central processing unit) and GPU (graphics processing unit). The higher the temperature, the greater the heat dissipation. If the heat dissipation effect is not good, the computer components will work at high temperature. On the one hand, the running speed will be affected. On the other hand, the life of the computer components will be shortened, and even irreversible losses will be caused. , so the notebook computer needs a heat sink with good heat dissipation. [0003] The heat dissipation effect of the notebook radiator in the prior art is not obvious. Generally, the heat dissipation fan is used to correspond to the heat dissipation fa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 江东干
Owner KUNSHAN HAOKAI METAL PROD
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