Method for making soft and hard double-sided circuit board

Abstract

The invention provides a method for making a soft and hard double-sided circuit board. The method comprises steps of substrate selection, waterproof processing, gap processing, hollow processing, cold pressing, packing and lamination coating, coating and false fixation with an iron, and hot and compact pressing through a quickly pressing machine. The method has the advantages that: (1) an adverse phenomenon that a back substrate at a PCB slot is depressed in the synthesis and pressing process of the substrate can be effectively solved, and the quality of a product circuit and resistance welding production is raised; (2) an adverse phenomenon that the substrate is raised at a place where a part in an FPC is reinforced in the synthesis and pressing process of the substrate can be effectively solved, and the quality of a product circuit and resistance welding production is raised; (3) two layers of FR4 synthesis structures are used, an adverse phenomenon that the substrate is depressed is solved, and a condition that a potion penetrates into the inner layer of the substrate from the PCB slot when the plating or the horizontal line of an overwetting process is made in the production process is avoided.

Description

technical field [0001] The invention relates to a method for manufacturing a double-sided circuit board, in particular to a method for manufacturing a soft-hard double-sided circuit board, which belongs to the field of circuit board printing. Background technique [0002] The composite structure of the product substrate of the traditional double-sided rigid-flex circuit board is a single-sided rigid board plus a layer of single-sided soft board bonded together by an adhesive. [0003] Main production process: 1. The single-sided PCB substrate is slotted in a specific area first; (the purpose of pre-grooving is to facilitate the removal of the PCB here in the final stage of the product); 2. AD glue is cut in a specific area 3. Paste the PI reinforcement board on a specific area on the single-sided FPC substrate; 4. Use AD glue as the adhesive in the middle layer, and connect the single-sided FPC substrate and the single-sided PCB substrate with The pressing method is combine...

AI Technical Summary

Problems solved by technology

[0004] Disadvantages of the existing product structure and process: 1. When doing electroplating or the horizontal line of the over-humidity process, the liquid medicine will penetrate from the PCB slot into the inner layer of the substrate, causing the liquid medicine to pollute the inner layer of the substrate, and at the same time in the subsequent production process There will also be liquid medicine flowing back from the inner layer, which will cause quality problems on the substrate and cause the product to be scrapped; 2. Because the PCB is grooved in advance, the FPC substrate has been grooved on the back and has no support during pressing and molding, which will cause the FPC substrate to have depressions Phenomena, there are obvious height differences, and many quality problems will be caused by the height difference in circuit production and solder mask production; Reinforcement will cause obvious protrusions on the FPC substrate after lamination, which will lead to many quality problems due to the uneven surface of the FPC substrate during circuit production and solder mask production.

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