Method for dynamic connection of radio frequency equipment
A technology of radio frequency equipment and dynamic connection, which is applied in the field of radio frequency systems, can solve the problems of unfavorable radio frequency electrical connection and the inability to meet the requirements of long-term reliable and stable operation of the radio frequency system, and achieve the effect of good radio frequency electrical connection
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0032] figure 1 with figure 2 The structural diagrams of the radio frequency equipment workpiece and the reed are given respectively, and the radio frequency equipment workpiece is a copper block. Using the method provided by the present invention to dynamically connect the radio frequency in the radio frequency equipment, the steps are as follows:
[0033] (1) Drill holes in the appropriate positions of the copper block and the reed for mechanical connection. Surface treatment of copper blocks and reeds before electroplating;
[0034] (2) Attach the copper block to the reed and connect it with rivets;
[0035] (3) Perform surface treatment before electroplating on the riveted copper block and reed.
[0036] (4) The riveted copper block and the reed are plated with silver as a whole, and the thickness of the silver layer is 20 μm.
[0037] After the above steps, it is obtained as image 3 As shown in the workpiece, it has been proved by experiments that the above-menti...
Embodiment 2
[0040] The difference from Example 1 is that the thickness of the silver layer is 80 μm. It has been proved by experiments that the method for realizing the radio frequency electrical connection in the radio frequency device by electroplating silver has high reliability and stability.
[0041]
Embodiment 3
[0043] The difference from Example 1 is that the plating layer is different. Before the riveted copper block and the reed are electroplated with silver as a whole, a layer of copper is plated and then electroplated with silver. The thickness of the copper layer is 60 μm, and the thickness of the silver layer is 35 μm. After Experiments have proved that the above-mentioned method for realizing radio-frequency electrical connection in radio-frequency equipment by electroplating a composite layer of copper and silver has high reliability and stability.
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com