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A cofferdam type water glue bonding process

A water-glue and cofferdam technology, applied in the field of cofferdam-type water-glue lamination technology, can solve problems affecting lamination efficiency and lamination machine pollution, so as to improve lamination yield, solve the problem of glue overflow, and prevent overflow effect

Inactive Publication Date: 2016-07-13
HUIZHOU NENGHUI CHEM CO LTD
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AI Technical Summary

Problems solved by technology

However, the traditional water-glue lamination has the following disadvantages: after the glue is applied, a part of the glue will overflow the bonding area during the leveling process, and even overflow to the front of the glass cover. It cannot be removed, which will affect the bonding efficiency and cause pollution to the bonding machine

Method used

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  • A cofferdam type water glue bonding process
  • A cofferdam type water glue bonding process

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all content.

[0015] Please refer to figure 1 As shown, in this embodiment, the glue with automatic initial curing function is named glue a, and the glue used for bonding is named glue b, 101 is the glue a dispensing area, 102 is the glue b dispensing area, and 103 is the functional glass Sheet, 104 is a flexible circuit board.

[0016] Such as figure 2 As shown, the cofferdam type water-glue bonding process in this embodiment specifically includes the following steps:

[0017] Step S201 , place the bound functional glass sheet 103 on the bonding platform, set th...

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Abstract

The invention discloses a cofferdam type water-glue bonding process, which includes the following steps: A. Place the bound functional glass sheet on a bonding platform, set the amount of glue dispensed, and place the glass sheet with automatic initial curing function The glue is uniformly dotted around the functional glass sheet. B. Stand still for 3-5 minutes for the functional glass sheet that has passed through the cofferdam in step A, set the amount of glue dispensed, and apply glue for bonding to the center of the functional glass sheet. C. Lay the glass cover plate with the functional glass sheet, and then fully cure the leveled water glue. Compared with the traditional water-glue bonding process, the present invention puts a layer of glue that can be automatically initially cured but will not be fully cured without treatment on the periphery of the bonding frame, and then the water-glue dispensing, bonding, and curing are carried out. , can effectively prevent glue overflow, effectively solve the problem of glue overflow, and improve the bonding yield.

Description

technical field [0001] The invention relates to the field of water-glue bonding technology, in particular to a cofferdam-type water-glue bonding technology. Background technique [0002] As the touch screen industry has more and more demands for G+G (glass cover plate + glass functional sheet) structure, due to the low bonding efficiency and finished product yield of solid optical glue, water glue is bound to become the G+G structure bonding The mainstream trend, the water-glue bonding process will be widely used in the back-end bonding of G+G capacitive screens. However, the traditional water-glue bonding has the following disadvantages: after the glue is applied, a part of the glue will overflow the bonding area during the leveling process, and even overflow to the front of the glass cover. After being cured by UV (ultraviolet) light It cannot be removed, which will affect the bonding efficiency and cause pollution to the bonding machine. Contents of the invention [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C27/10
Inventor 吴国峰
Owner HUIZHOU NENGHUI CHEM CO LTD
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