Surface treatment device for printed circuit board copper foil

Abstract

The invention discloses a surface treatment device for a printed circuit board copper foil. The surface treatment device comprises a tank body, water pumping openings and rubber water pouring rollers, wherein two groups of rubber water pouring rollers are arranged on two side walls of the tank body; a circuit board substrate is arranged between the two groups of rubber water pouring rollers; the water pumping openings are formed in the upper part of the tank body; medicinal liquid for surface treatment is contained in the tank body; a water outlet with an adjustment valve is formed in the bottom of the tank body. The surface treatment device has the beneficial effects that the height of the liquid level of the medicinal liquid is controlled by controlling the displacement of the adjustment valve of the water outlet, so that an OSP (antioxidant) film can be uniformly and effectively formed on a copper surface of a product; oxidization of the product is avoided; the cyclic displacement of the OSP medicinal liquid is controlled according to different thicknesses of different products, so that the waste of the OSP medicinal liquid is avoided; therefore, the quality of the product is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to a circuit board surface treatment device, in particular to a printed circuit board copper foil surface treatment device. Background technique [0002] OSP is a process for the surface treatment of printed circuit board (PCB) copper foil that meets the requirements of the RoHS directive. OSP is an organic solder protection film, also known as copper protection agent. The existing OSP surface treatment device is pumped from the upper part of the tank. The potion is discharged from the bottom of the tank to realize the circulation of the potion during the production process. Due to the method of adopting the horizontal opening, the discharge volume of the liquid medicine cannot be adjusted, and the liquid level of the OSP liquid medicine cannot be adjusted. When the OSP liquid is pumped into the tank, air bubbles will be generated. When the OSP liquid level is equal to or slightly higher than the product surface, the air bubbles ...

AI Technical Summary

Problems solved by technology

Due to the method of horizontal opening, the discharge volume of the potion cannot be adjusted, and the liquid level of the OSP potion cannot be adjusted

When the OSP liquid is pumped into the tank, air bubbles will be generated. When the OSP liquid level is equal to or slightly higher than the product surface, the air bubbles will adhere to the product surface, preventing the OSP liquid from reacting with the copper surface, resulting in copper surface of the product. The OSP film cannot be formed, and the expected effect of preventing the oxidation of the copper surface of the product cannot be achieved. Some products need to do OSP repeatedly. Since the copper surface will become thinner each time the OSP operation is performed, the product that cannot form the OSP film after two OSP operations Can only be scrapped

At the same time, the discharge of the liquid medicine is uncontrollable, which causes waste of liquid medicine when producing thinner products

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